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If, as we heard at last week’s 3D IC Forum at SEMICON Singapore, that technology challenges and cost are no longer keeping 3D ICs from volume manufacturing, and indeed the key players are ready to go, then what’s it going to take to get this 3D IC adoption party started?...
When I saw that Dev Gupta, Ph.D, of Advanced Packaging & Systems Technology Laboratories, LLC (APSTL) was presenting at the IMAPS Arizona Chapter luncheon last week, there was no questioning my attendance. Dr. Gupta has been an active participant on 3D InCites, offering regular commentary on posts, so I was...
Mobile/smart devices will continue to drive innovation and volumes in the semiconductor industry in 2014. The much discussed “Internet of Things” is a vision for the next growth cycle, and while we see this vision eventually coming true, the industry is very early in the cycle. It will take a...
The 3rd annual Global Interposer Technology Workshop (GIT 2013) was held at the Georgia Institute of Technology on November 18-20, 2013. Over 200 people from 11 countries attended this in-depth and lively discussion about interposers. Although many people think the conference is focused on glass (Glass Interposer Technology – another use...
…For while the tired waves, vainly breaking, Seem here no painful inch to gain, Far back, through creeks and inlets making, Comes silent, flooding in, the main…. (Excerpt from Say not the Struggle Naught Availeth, by Arthur Hugh Clough. 1819–1861) Sitaram Arkalgud, Invensas, quoted this verse to me yesterday over...
Did you know that when foundries talk about 14nm and 16nm node chips, these devices are in reality no denser than their 20nm predecessors? Or that a particular node name does not reflect the size of any particular chip feature, as it once did? Or that since 2007, the doubling...
Approximately 880 people registered for IMAPS International 2013, and yes the fiasco in Washington even affected IMAPS – there were last minute cancellations from people who work directly or indirectly for the government. But I was there, and here are the highlights: Qualcomm : Vidhya Ramachandran presented data on a...
A recent IEEC and IEEE CPMT workshop held on October 16, 2013 at Binghamton University in New York examined the status of 2.5D and 3D ICs for high performance systems. There is no question that 3D ICs with through silicon vias (TSV) remain driven by concerns over astronomical lithography cost at...
There’s been a lot of buzz around 3D NAND in the past few weeks, sparked by Samsung’s recent announcement that it was commercializing its 3D VNAND technology. There’s also been some discussion (mixed with concern) about how, if at all, 3D NAND might affect the commercialization of TSV-based 3D DRAM...
At last week’s Memcon 2013, which took place Tuesday, August 6, 2013, at the Santa Clara Convention Center, Keynoter Bob Brennen, Senior VP at Samsung, talked about the need for New DRAM and Flash Memory architectures. Richard Goering summarized Brennan’s keynote very well in his blog post. Because Brennan’s responsibility...
