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TSMC calls them 3D Super Chips. The rest of the industry calls it 3D heterogeneous integration. Whatever way you slice it, either 2.5D or 3D IC, it requires TSV technology for its method of interconnect. Here are a few recent items about the latest progress in the march to commercialization...
Multi-Die Integration Provides Multifaceted Solutions By Francoise von Trapp, 3D InCites This year’s Roadmaps for Multi-Die Integration Symposium, hosted by MEPTEC on November 14, 2012 at the Biltmore Hotel in Santa Clara, CA, offered some interesting and different perspectives than the garden-variety 2.5D and 3D IC conferences of late. While...
Have you noticed that it’s not even Halloween and the stores are already setting up their Christmas sections? Seems to happen earlier and earlier every year. It’s no coincidence that Apple and Microsoft timed their latest product launches in time to ride that wave. Since tablets and smartphones have been...
Because 3D Memory really stands out as an industry apart from 3D ICs, I’ve been collecting some interesting articles over the past few weeks, with the intention of bringing 3D InCites a curated update. Here it is. In the wake of JEDEC’s announcement that it had released its specification for...
It’s been one of those Mondays. I started making the coffee this morning (put in a clean filter, poured in the water) before I got sidetracked and hit the shower without ever putting in the grounds or turning it on. Then I left the Impress Labs office without my key...
I always hesitate to cove 3D transistors, because before they came along, I only focused on what I knew to be 3D – ie: 3D stacked packages, 2.5D interposers and 3D ICs. And that was confusing enough. But then along came Intel’s Tri-Gate technology, claiming the 3D moniker as its...
Up until recently, I really hadn’t paid much attention to the the intricacies of memory types required to satisfy the plethora of computing needs from today’s PCs to tomorrow’s data centers and mobile devices. I had a general understanding of caches and main memory, and the increasing need for shorter...
While there’s no denying that our registered members, guest bloggers, forum panelists, advisory board, and regular readers are all vital elements of the 3D InCites community, none of this would be possible without the financial input of our advertisers. So I would like to briefly take up some blog space...
Is it mere co-incidence that companies who have invested in 3D technologies seem to have escaped the effects of the downturn and are the companies poised to lead industry growth? I think not. In speaking with various 3D companies at SEMICON West, they all seemed to have good news to...
Keith Cooper, Technology and Development, SET North America reports from ECTC 2010's Medical Device Market Panel, offering a view beyond the packaging lab, into the progress and potential of the medical devices that will benefit from 3D integration technologies. A discussion panel on medical devices opened this year’s Electronic Components...
