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TSMC considers Packaging Facility in the US The Taipei Times is reporting (via Nikkei Japan) that TSMC is considering building an advanced IC packaging facility in the US. The potential US packaging plant would be equipped with the latest 3D stacking technologies. IC packaging is highly localized in Asia and...
AP foundry production to increase by 20x in 2022 NHanced Semiconductors is expanding the cleanroom of its North Carolina foundry to house a new high-volume line of advanced packaging (AP) equipment. The new line – the first of its kind in the US – will run in parallel with the...
The IEEE International Solid-State Circuits Conference, – ISSCC 2021 – took place in late February. As we have suspected for some time, these formerly front-end conferences are more and more focusing on packaging and the performance advances you get from new packaging architectures. Let’s first take a look at what...
A number of research articles have been published over the past several years showing the advantages glass-based solutions can bring to packaging and systems integration including radio frequency (RF) front-end devices, interposers, MEMs devices, and integrated photonics. In particular, RF applications for glass are gaining interest for use as a...
CEA-Leti and Intel recently announced a new collaboration effort on advanced 3D packaging technologies for processors to advance chip design. The research focuses on the assembly of smaller chiplets optimizing the interconnect technologies between the different microprocessors and on new bonding and stacking technologies for 3D ICs focused on high-performance...
LITHOSCALE® incorporates EVG’s MLE™ (Maskless Exposure) technology to bring the benefits of digital lithography to a wide range of applications and markets EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the LITHOSCALE® maskless exposure system – the...
Newly opened Cleanroom V building nearly doubles cleanroom capacity and strengthens capabilities of EVG’s NILPhotonics® and Heterogeneous Integration Competence Centers EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has completed construction of its new Cleanroom...
EVG achieves ranking among THE BEST Suppliers to Foundation Chip Makers for the first time in survey results; continues win streak with 18th consecutive year listed among “THE BEST” suppliers EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology, and semiconductor markets, today...
Rochester, NY — Mosaic Microsystems, a microelectronics and photonics packaging company, providing thin glass substrates and through glass vias (TGVs) for next generation products in RF communications, particularly for 5G, as well as MEMs and sensors for the internet of things (IoT) has reported a significant investment into the business. Christine...
The 52nd International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS) starts next week. Key package platforms will include system-in-package (SiP), system in module (SiM). chip-package interaction (CPI), wafer level/panel Level, 2.5D/3D/flip chip/optical, as well as high reliablity/performance, and advanced process/materials. IMAPS 2019 will host...
