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MRSI Systems (Mycronic Group) is pleased to announce the latest advancement in the MRSI-H/HVM-series line of die bonders. Placement accuracy was tested using industry-standard glass die reference samples. Results showed enhancement from ±3 µm at 3 sigma, to ±1.5 µm at 3 sigma. Moving forward for shipment starting from October...
Not all SemiSisters are engineers. In fact, many of us joined this industry from a variety of career backgrounds with non-STEM educations including financial, business management, market research, marketing communications, journalism, and even liberal arts. For us, one of the greatest hurdles to overcome was learning a whole new lexicon...
In 1994 TSMC, a small wafer foundry from Taiwan held its first Technology Symposium. Since 1999 I have had the privilege to work with TSMC and closely follow their success in building a powerful and cost-effective ecosystem for the fabless IC vendors and foundry business model. To measure their success...
After spending three days in the company of the IMAPS community at the 15th annual IMAPS Device Packaging Conference (IMAPS DPC) March5-7,2019, in Fountain Hills, Arizona, I am once again reminded why I chose to focus 3D InCites on the advanced packaging segment of the semiconductor industry. The technology is...
MRSI Systems, part of the Mycronic Group is pleased to announce the appointment of Dr. Limin Zhou as the Senior Director of Strategic Marketing to expand MRSI’s market presence in China. He will be working alongside our existing sales team and representatives in the region. Dr. Zhou’s deep knowledge of...
Wilmington, Mass. (January 15, 2019)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has received orders for over $15 million of legacy and new process control systems from a memory manufacturer based in Asia. The systems will be used by a top-tier memory chip maker as they rapidly transition high-end DRAM...
According to the market research and strategy consulting company, Yole Développement (Yole), the polymeric materials market revenue will double over the next five years. Driven by movements towards further miniaturization and higher functionalities, megatrend applications like artificial intelligence (AI), 5G, and augmented/virtual reality (AR/VR) are creating huge business opportunities. Therefore,...
First a word on the change in venue… After working with Pete Singer at Solid State Technology from 2010-2018 and previously at Semiconductor International from 2007 – 2010 (as PFTLE), I have decided to move my packaging blog, IFTLE, to a new platform. I will be forever indebted to Pete...
For the past few years, the ECTC committee has provided 3D InCites with a table outside the session rooms, rather than the technology corner, as part of our media trade. We consider it to be prime real estate, as pretty much everyone passes by the table at one time or...
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has received an order for its EVG®120 automated resist processing system from VTT Technical Research Centre of Finland (VTT). An existing customer of EVG’s wafer bonding and...
