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EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has started construction work for the next expansion phase of its corporate headquarters. The new, state-of-the-art building will house EVG’s “Manufacturing III” facility, which will more than...
This year’s European 3D Summit in Dresden, which highlighted “Heterogeneous Integration Driving 3D”, was led off by presentations and a lab tour of the Fraunhofer Institute, whose 18 high-performance centers collaborate with companies, universities and other research institutes in Germany. All pictures and diagrams courtesy of Fraunhofer IZM. The Fraunhofer...
Françoise promised in her recent blog that my ECTC blog would follow shortly. Finally, after attending DAC in Austin as well as the iMAPS’ SiP Conference in California’s Wine Country and shortly before attending Semicon West in San Francisco, I found some time to report what I saw and learned...
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that, for the fifth successive year, it has earned all three awards resulting from VLSIresearch’s annual Customer Satisfaction Survey. For 2017, EVG was ranked as one of the 10...
North Billerica, MA, USA, March 20, 2017 — MRSI Systems, a leading provider of fully automated, high-speed, high-precision die bonding and epoxy dispensing systems, today announces the installation of its flagship MRSI-M3 Die Bonder in AIM Photonics Academy’s Education and Practice Factory at the Massachusetts Institute of Technology (MIT) in...
FLORIAN, Austria, March 8, 2017—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled the IQ Aligner NT—its latest and most advanced automated mask alignment system for high-volume advanced packaging applications. Featuring high-intensity and high-uniformity exposure optics, new wafer...
The 3D Architectures for Semiconductor Integration and Packaging (3D ASIP) conference is one of the biggest (if not THE biggest) event focused exclusively on the 3D IC family of technologies. The December 2016 event was held even closer to San Francisco airport than in previous years. From the lobby of...
Consumer electronics designers continue to demand thinner and lighter packages while devices increase in functional complexity. The Fan-Out Wafer Level Package (FOWLP) platform has been gaining momentum with the advantages it offers in electrical performance, assembly process efficiency and low geometric profile. Different approaches of Package-on-Package (PoP) stacking in FOWLP...
The Challenges of Manufacturing 3D Stackable Memory Memory technologies vying to fulfill the increasing capacity and density requirements of the solid-state storage market two years from now will be confronted by having to meet demanding cell performance and cost-per-bit metrics to be viable. Today, NAND technology is still the primary...
Reader’s Choice Award Amkor: SLIM Francoise von TrappJune 22, 2015 Awards-Devices, Awards-Winner0 Amkor’s SLIM (siliconless integrated module) is a dies-last package technology providing the thinnest possible form factor with the highest level of integration by use of back-end-of-line technology combined with assembly-based fan-out architectures. It has optimal registration, 3D access to...
