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While GLOBALFOUNDRIES and STATS ChipPAC may have it all figured out, there are many who still consider temporary bond/debond (TB/DB) to be an unsolvable challenge that adds unnecessary cost. The solution? Find a way to do away with it altogether. During the 3D IC Forum at SEMICON Singapore, both A*STAR...
Ladies and Gentlemen of the semiconductor industry, we have a new acronym to add to 3D integration lexicon and its name is 3D SoC (aka: 3D system on a chip, or 3D system partitioning, or mixed node integration – take your pick). Whatever the moniker, it looks like THIS is...
To the readers of 3D InCites: Happy New Year! I hope your 2014 will be a healthy and prosperous one for you and for your families, and I hope you will continue following 3D InCites (and maybe even be contributing yourselves) as the year progresses. Now that the Internet of...
Ziptronix Inc., provider of patented, low-temperature direct bonding technology for 3D integration, announced an agreement with Tezzaron Semiconductor Corporation and Novati Technologies, a wholly owned subsidiary of Tezzaron, as a next step toward the acceleration of 3D integration. As a key part of the agreement, Ziptronix sold its 3D IC...
What can we expect out of 2.5 and 3D TSV Integration? What are the three leading-edge R&D institutes in 2.5 and 3D TSV investigating? On November 18, SEMI offered a webinar entitled “3D TSV without Limits.” Francoise von Trapp of 3D InCites moderated the webinar which featured Eric Beyne, director...
The IEEE 3D Systems Integration Conference (IEEE 3D IC) is a unique event that is a truly international effort in assembling all those involved in research and commercialization of 3D IC and 3D systems from around the world. Location for the event rotates annually from Munich to Tokyo to San Francisco. This...
For me, SEMICON West involves a careful balance of attending sessions, keynotes and panels, combined with one-on-one interviews with thought leaders in 3D ICs, as well as manufacturing suppliers who have the onerous task of developing, promoting, and selling the next great solution for 2.5D and 3D IC manufacturing. Over...
Product Description Copper DBI® technology is a patented low cost, scalable process technology that was licensed for 3D memory assemblies in December 2012. Copper DBI® technology offers higher throughput and better scalability when compared to copper thermo-compression bonding. This technology can be incorporated into die-to-die, die-to-wafer and wafer-to-wafer processes. Testimonial...
Product Description The EVG850TB/DB XT temporary bonding/debonding platform addresses the high volume manufacturing needs for thin wafer processing. Nine process modules combined with integrated FOUP storage system allow true continuous mode of operation with an unprecedented throughput of >40 bonds/debonds per hour. The EVG850TB/DB XT supports all common bonding adhesives...
CoatsClean™ combines process, equipment and formulation technology to deliver innovative, low cost-of-ownership approach to single-wafer photoresist and residue removal ST. FLORIAN, Austria and INDIANAPOLIS, Ind., June 17, 2013—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment, and Dynaloy, LLC, an international manufacturer of chemicals for the electronics...
