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The R&D centers were out in full force at this year’s SEMICON West, presenting on their latest activities in all areas of 3D technologies, from 3D transistors, to 3D ICS, to full-blown 3D Systems. I was able to attend a smattering of presentations at events hosted by imec, CEA-Leti, SEMATECH...
Georgia Tech’s Packaging Research Center, in its pioneering chip-last embedded interconnection technology, demonstrates World's Thinnest 3D Organic Package at 130um thickness at 30um interconnection pitch using ultra-short copper-copper interconnections and bonding below 200oC for highest electrical performance. The "Ultra-SLIM Packages have built-in vertical connections to the top surface
Repeat Order for IQ Aligner Further Solidifies EVG’s Position as Leading Microlens Molding Solutions Provider for Wafer-level Camera Applications St. Florian, AUSTRIA, March 27, 2012 – EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that Himax Technologies,...
Last week, SEMATECH and ISMI announced they would be conducting Equipment Maturity Assessments (EMAs) of several critical 3D tools during 2012 to establish functional equipment capabilities and address high volume manufacturing (HVM) maturity issues for 3D IC manufacturing. This is a significant step in SEMATECH’s goal to accelerate the 3D...
To enable high-volume production readiness of 3D-based products, SEMATECH’s 3D Interconnect and Manufacturability programs will be conducting Equipment Maturity Assessments (EMAs) of several critical 3D tools during 2012 to establish functional equipment capabilities and address high volume manufacturing maturity issues. The assessment is a cooperative effort among experts from SEMATECH’s...
I knew when I visited EV Group’s world headquarters in Schärding, Austria two years ago that there was an ongoing story here and I would be returning to write about the next phase of growth. (This time, we’ll be catching it all on video as well.) What I didn’t anticipate...
I was so busy making sure I have all the bios and presentations for the 3D sessions I’m chairing at this year’s IWLPC, which got underway today with its half-day tutorials, that I was LATE checking in on Southwest and ended up in the B group for boarding. I hate...
SEMATECH, the Semiconductor Industry Association (SIA), and Semiconductor Research Corporation (SRC) announced today they have established a new 3D Enablement program to drive cohesive industry standardization efforts and technical specifications for heterogeneous 3D integration. Administered by SEMATECH’s 3D Interconnect program, based at the College of Nanoscale Science and Engineering (CNSE)
EV Group (EVG), supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, announced that it has developed a new micro-lens molding process that can enable volume production of very-high-resolution (up to eight megapixels and higher) wafer-level optics for use in smart phones, pico projectors and...
It’s hard to believe I’ve been at this for a almost a year.
