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May member news showcases significant strides in advancing semiconductor technologies and fostering sustainability efforts. From strategic divestitures and innovative product launches to educational initiatives and workforce development programs, the semiconductor industry continues to evolve and thrive. Dive into the latest updates from our member companies and stay informed about the...
The dedicated HVM EVG®880 LayerRelease™ system boosts productivity and lowers the cost-of-ownership of novel infrared laser release technology through silicon carrier wafers for 3D integration applications EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology, and semiconductor markets, today introduced the EVG®880 LayerRelease™...
SEMICON Europa 2023, co-located with productronica in Munich, Germany makes for one of the strongest single events for electronics manufacturing in Europe. Together, SEMICON Europa and productronica showcase the entire spectrum of technologies and solutions for the entire semiconductor and electronics manufacturing industries, reflecting the rapid pace of technological development...
At the 2023 IMAPS Symposium in October, I had some great community member conversations about some of the hot topics of the day. They shared their opinions on everything from the possibility of the U.S. onshoring advanced packaging technology in high volumes, to the impact of germanium and gallium restrictions...
Irvine, CA – Henkel today announced the commercialization of a high-performance non-conductive die attach film (ncDAF) engineered to address the demands of contemporary packaging device designs. Loctite Ablestik ATB 125GR is a high-reliability ncDAF suitable for wirebond laminate and lead frame packages, compatible with small- to medium-sized die, and formulated...
MRSI Systems (Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding and epoxy dispensing systems is proud to announce the introduction of the MRSI-HVM1 and MRSI-H1 die bonders with 1µm machine accuracy. The new products, MRSI-H1 and MRSI-HVM1, have been developed from our popular MRSI-H/MRSI-HVM platforms,...
This whole week had been going so smoothly, I should have known I was due at least one mishap along the way. It happened on the beginning of Day 5. My challenge was to navigate the Swiss/French train system and get myself from Geneva to Annecy, France, for my morning...
I have to admit that this year at IMAPS Device Packaging Conference, I spent more time attending technical sessions and less time with the exhibitors than I usually do at an industry event. However, I did manage to check in with a few of them to see what their latest...
It’s only Tuesday, and already, it’s been a productive week for 3D news.
Ok, I realize it’s not really the New Year, but for me, September is always about beginnings. The school year gets underway on most continents (except in Arizona, where its been in full swing for three weeks). It marks the end of summer holidays in Europe (Is August also holiday...
