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MRSI Systems is delighted to announce a new collaboration with Lumentum Operations LLC (“Lumentum“, NASDAQ: LITE), a leading global photonic chip and module supplier for the automotive LiDAR industry. This collaboration promises to generate innovative LiDAR solutions for the industry. LiDAR (light detection and ranging) technology is becoming the standard...
ST. FLORIAN, Austria, January 18, 2022—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG®7300 automated SmartNIL® nanoimprint and wafer-level optics system. The EVG7300 is the company’s most advanced solution to combine multiple UV-based process capabilities, such...
Like every other awards event in the past year, the 2021 3D InCites Awards Program had to make some adjustments for celebrating its winners. We can’t gather in person at the IMAPS Device Packaging Conference to applaud the winners, catch up with colleagues over a great barbeque, watch the 3D...
Smoltek keep growing its proprietary technology platform. In March 2020, the 57th patent was granted. This is a Pan-European patent which covers interconnects applications. This is the second granted patent in 2020 and as it is a European (EPO) patent that will be validated in relevant European countries. The actual...
SUSS MicroTec, leading supplier of equipment and process solutions for the semiconductor industry, announced today a far-reaching collaboration agreement with BRIDG, a not-for-profit, public-private partnership focused on production process technologies, advanced system integration, and 200mm microelectronics fabrication advancing next-generation nanoscale technology. This partnership puts an unprecedented array of SUSS MicroTec...
The trade show floors at the combined SEMICON Europa and Productronica events can be daunting. In past years, we’ve focused our visits on the SEMICON Europa exhibitor floor, but as the lines fade between front-end processes, advanced packaging, and board assembly, getting the whole story called for visits to the...
In this IFTLE post, we continue our look at presentations from the 2018 EPTC Conference… Ultratech / IMEC / JSR – 1µm RDL Ultratech, IMEC and JSR discussed “One Micron Damascene Redistribution for Fan-Out Wafer Level Packaging using a Photosensitive Dielectric Material”. This study compared the creation of 1.0μm RDL...
The Microelectronics Packaging and Test Engineering Council (MEPTEC) held its annual heterogeneous integration symposium at SEMI’s headquarters in Milpitas, CA on December 5, 2018. Many manufacturing and test, as well as electronic design automation (EDA) and IC design experts, got together to present and discuss how to integrate heterogeneous functions...
Throughout my years of writing about the semiconductor industry, I’ve met women from all over the world. I’ve often wondered what or who encouraged them to pursue careers in this male-centric environment? How much of their motivation is inspired by the culture of where they grew up? Can success be...
The 2021 3D InCites Awards program recognized industry-wide contributions in the development of heterogeneous integration and 3D technologies. We expanded our scope of coverage, adding a special focus on sustainable manufacturing efforts, as well as diversity equity and inclusion (DEI) with two special award categories. Like every other awards event in the...
