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NHanced Semiconductors Announces Delivery of the First Next-Generation Hybrid Bonding System from BE Semiconductor Industries

May 29, 2024

The Besi Datacon 8800 CHAMEO ultra plus advanced hybrid bonding system delivers faster throughput, enhanced accuracy, and superior warpage control for room temperature direct fusion & hybrid bonding processes. NHanced Semiconductors, the first U.S.-based pure-play advanced packaging foundry, announced the delivery of the first BE Semiconductor Industries (Besi) next-generation hybrid bonding system to the NHanced advanced...

ClassOne Technology and Fraunhofer ENAS to Collaborate on Hybrid Bonding for Advanced Imaging Devices

Jun 02, 2022

Partnership will leverage firms’ respective heterogeneous-integration proficiencies to focus on development and optimization of full process-integration schemes for diverse high-density pixel array applications Kalispell, Mont. – June 2, 2022 – ClassOne Technology, a leading global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, today announced it is...

Xperi and LAPIS, a ROHM Group Company, Enter into Hybrid Bonding License Agreement

May 09, 2022

Technology transfer includes DBI® Ultra die-to-wafer hybrid bonding know-how SAN JOSE, Calif. & YOKOHAMA, Japan, May 04, 2022–(BUSINESS WIRE)–Adeia, the newly launched brand for the intellectual property (IP) licensing business of Xperi Holding Corporation (NASDAQ: XPER) (“Xperi”) and LAPIS Technology Co., Ltd., (“LAPIS”), a ROHM Group subsidiary, today announced an agreement that includes...

Another Strong Year Ahead for Hybrid Bonding Thanks to Heterogeneous Integration

Feb 09, 2022

While the COVID-19 pandemic has continued to cause mass disruption to the global economy during the past year, one notable bright spot has been within the semiconductor industry, where fab spending in new process equipment reached a new record high of more than $100B according to SEMI. This spending growth...

IFTLE 508: IEEE 3DIC: Hybrid bonding for GaN on Silicon HI; Intel discusses chiplets

Jan 03, 2022

The IEEE 3DIC Conference was held at North Carolina State University in Raleigh NC in person from Nov 15-18 2021. The Conference Chair was Paul Franzon. Let’s take a look at some of the key presentations. CEA Leti – Copper Hybrid Bonding for GaN on Silicon Dubarry of Leti presented...

IFTLE 504: YMTC Implements Hybrid Bonding for 128-Layer 3D NAND

Dec 06, 2021

Xperi Licenses Hybrid Bonding Technology to YMTC (Yangtze Memory Technologies Co) In October, Xperi announced it had licensed its hybrid bonding portfolio to YMTC, part of the Tsinghua Unigroup in China. TechInsights had previously confirmed that YMTC is using hybrid bonding in its 128-layer 3D NAND products (Figure 1). YMTC,...

Xperi Licenses Hybrid Bonding Technology to Yangtze Memory Technologies Co., Ltd. (YMTC)

Oct 12, 2021

Direct Bond Interconnect (DBI®) hybrid bonding portfolio licensed to YMTC for its 3D NAND memory products SAN JOSE, Calif. –Xperi Holding Corporation™ (NASDAQ: XPER) (“Xperi”) today announced that the company entered into a license agreement with Yangtze Memory Technologies Co., Ltd. (YMTC), a world-class memory solutions company based in China....

IFTLE 489: AMAT Addresses Hybrid Bonding; DECA M-Series Continues to Develop

Jun 24, 2021

Let’s take a final look at some of the presentations from the 2021 IMAPS Device Packaging workshop. Applied Materials Applied Materials (AMAT) discussed “Through Silicon Vias (TSVs) and Hybrid Bonding Solutions for Heterogeneous Integration…”. AMAT notes that hybrid bonding is not a new technology but rather has been commercialized for...

IFTLE 401: FOWLP for RF; D2W Hybrid Bonding; FOPLP in Samsung Watch

Jan 03, 2019

As its name implies, the International Wafer Level Packaging Conference (IWLPC) initially covered wafer-level packaging (WLP) technologies. As all conferences do, it soon expanded its scope to cover basically all advanced packaging topics including WLP, fan-out wafer-level packaging (FOWLP), 2.5D/3D, and advanced manufacturing and test, etc. Statistics from this year’s...

Xperi and UMC Partner to Produce Direct and Hybrid Bonding 3D Semiconductor Technologies

Aug 02, 2018

SAN JOSE, Calif. (August 2, 2018) – Xperi Corporation (Nasdaq: XPER) (“Xperi”) is pleased to announce a partnership with leading global semiconductor foundry, UMC. This strategic partnership will enable the companies to support the growing demand for Invensas’ direct and hybrid bonding (ZiBond® and DBI®) 3D semiconductor technologies. Together, Xperi and...