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EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today announced the expansion of its management board. To further strengthen the company’s position in semiconductor and adjacent markets, Alexander Rank will support the company’s management team as...
Managing the System-level Netlist and Its Exceptions in 3D ICs 3D IC is a growing semiconductor technology that pushes the limits of single-die designs. Splitting a large die into multiple smaller dies has proven to provide an acceptable yield and reify the era of chiplets, which has elevated IP reuse...
It’s common knowledge among those working feverishly to bring 3D TSVs to market that one of the areas still being ironed out in the back-end-of-line processes is thin wafer handling.
Another early start (5:30am) to catch the train to Grenoble. The trains went on strike (a regularly scheduled occurrence) but lucky for me, the strike didn’t affect trains running before 8am. (I love France. They’re so civilized here…) As I wasn’t scheduled to meet with the team from Soitec until...
I consider myself to be fairly savvy when it comes to knowing who the players are in 3D IC technology research, so when I first saw the news article in EDN reporting that TNO, an Eindhoven-based scientific research company, had approached BESI/Datacon to develop a high-end pick-and place tool for...
With the recent announcement of CEA-Léti and Brewer Science's agreement to create a common lab for further development of 3D stacking processes using Léti’s thin wafer handling processes and Brewer Science, Inc. (BSI) WaferBOND™ materials, I realized although both names popped up frequently in relation to the
I don’t get to attend all the 3D events that I would like to, and such was the case with this year’s GSA Silicon Summit, held Thursday, April 26, in San Jose. But I did get some insight from Rich Rice, Senior VP of Sales and Engineering, ASE, who was...
Ever since I got involved in the world of advanced packaging, and particularly 3D, I’ve had a soft spot for start-ups. Everyone who reads my blog knows that. So it’s no surprise that I’ve had Ziptronix on my radar since the first press tour in 2007. I was impressed by...
New System Provides World-class Alignment Technology at an Affordable Cost
With a focus on providing cost-effective and reliable solutions to speed manufacturing readiness of 3D technology options, experts from SEMATECH’s 3D interconnect program based at the College of Nanoscale Science and Engineering’s (CNSE) Albany NanoTech Complex outlined new developments in wafer bonding, copper removal, and wafer thinning at the 2010...
