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Taking place from September 3-6, SEMICON Taiwan 2024 is just around the corner. With this year’s theme, Breaking Limits: Powering the AI Era, the event will showcase how the semiconductor industry is driving AI technology. We’re excited to share that SEMI, one of our member companies, has achieved record sales...
The 2024 SEMI Europe 3D & Systems Summit takes place on June 12-14 at the Hilton Hotel in Dresden, Germany. Aptly themed Heterogeneous Systems for the Intelligently Connected Era, this conference will focus on component integration for powering the next wave of technological innovation. From artificial intelligence, sensor data processing,...
An AI package is like a puzzle made up of individual pieces of different sizes and shapes, each one essential to the final product. Together, these pieces are typically integrated into a 2.5D IC package designed to reduce footprint and maximize bandwidth. A graphic processing unit (GPU) and multiple 3D...
March buzzed with innovation and collaboration in the semiconductor industry, as key players across the globe joined forces to advance technology, foster education, and address sustainability challenges. From groundbreaking product launches to strategic partnerships and workforce development initiatives, here are the highlights of 3D InCites members’ industry news, events, and...
IMAPS 20th Annual Device Packaging Conference – Event Highlights The International Microelectronics Assembly and Packaging Society (IMAPS) 20th annual Device Packaging Conference (DPC), is scheduled from March 18 to 21 in Fountain Hills, AZ. Simultaneously, the Workshop on Advanced Packaging for Medical Microelectronics will take place at the WeKoPa Resort...
SEMICON China 2024 takes place March 20-22 at the Shanghai New International Expo Centre. This year’s event is expected to draw the attention of the global semiconductor supply chain as the country continues considerable capacity expansion to increase its share of global semiconductor capacity. According to the SEMI Year-End Total Semiconductor...
As IFTLE has explained previously, Investments in semiconductors will not succeed without investments in advanced packaging. The CHIPS for America program, agreeing with this premise, has announced that it will support the development of advanced packaging technology in the United States that can be transferred to manufacturing facilities, including recipients...
As they do every year, semiconductor industry leaders gathered in Half Moon Bay, CA in early January for SEMI ISS 2024 to take stock of the economic trends and market drivers to set their corporate strategies for 2024. Appropriately, the weather outside the Ritz-Carlton, overlooking the Pacific Ocean, matched the...
Challenges to 3DHI and chiplets remain, but new advanced packaging foundry solutions are stacking up The industry consensus is that the path to extending Moore’s Law lies in heterogeneous integration (HI) and chiplet architectures. Why, then, are we still waiting for the full adoption of HI, 3DHI, and chiplets? The...
At SEMICON Europa 2023, we heard more good news about 3D heterogeneous Integration from speakers at the CEO Summit and the Advanced Packaging Conference. Not only has it become the champion for the continuation of Moore’s Law scaling, but it also allows us to deliver on power performance area and...
