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Advanced Packaging’s Growth in AI TechSearch International’s latest analysis examines the demand for packages used in AI. As the industry enters the AI era, successful hardware deployment requires a supply of silicon interposers, or alternatives such as redistribution layer (RDL) structures and advanced laminates, to support high density. With the...
I’ve had about a week to process, ponder, and reflect on all the information I absorbed last week at SEMICON West 2023. From the speakers at imec’s ITF USA and SEMICON West’s CEO Keynote Summit to the numerous podcast interviews with industry experts, it all boils down to one key...
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and Dymek Company, an advanced equipment distributor for the semiconductor, biomedical, data storage, photovoltaic and aerospace industries, today announced that they have established a new joint venture company in Malaysia. The new...
Amkor Technology, Inc. is one of the world’s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test and is now a strategic manufacturing partner for the world’s leading semiconductor companies, foundries and electronics OEMs. Amkor’s operational base includes...
Let’s continue our look at papers presented during October’s IPC Advanced Packaging Symposium: “Building the IC-Substrate and Package Assembly Ecosystem”. NIST and the US CHIPS Act As we all know by now, the CHIPS and Science Act is being managed by NIST under the Dept of Commerce. NIST has always...
TechSearch International’s latest report: 2022 Flip Chip and WLP: Trends and Market Forecasts examines the impact of slowing consumer demand on the flip chip and WLP market growth. The report includes an examination of both fan-in WLP and fan-out WLP markets. The report also examines bump pitch trends and the...
Chaired by 3D InCites Community member Steffen Kröhnert of ESPAT Consulting, the Electronics System-Integration Technology Conferences (ESTC) series is a premier venue for academics and industry to present and discuss the latest developments in assembly and interconnection technology and new applications. This year, the event is being held in Sibiu,...
TechSearch International’s latest analysis describes high-performance package options with an update on TSMC’s new offerings, including the latest organics CoWoS® versions. New high-end product examples using fan-out on substrate are discussed. Features of the build-up substrates supporting redistribution layer (RDL) structures are provided. Applications for high-performance wafer-to-wafer hybrid bonding are...
One of the most popular booths at the recent IMAPS DPC was that of wafer-level fan-out technology provider, Deca. Their black tee shirts state “SHIFT HAPPENS” on the front and on the back say, “We clean it up” (referring to their adaptive patterning of course). Also of great interest was...
Reshoring With the ongoing deluge of reshoring activity in the US, it is good to see others pointing out that just manufacturing chips is not what we are after. As IFTLE has steadfastly stated, we need the complete infrastructure moved back onshore and that absolutely includes the new golden child:...
