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ASE, Inc. CEO, Dr. Tien Wu, has often referred to Sun Tzu’s legendary quote when describing semiconductor market volatility, “In the midst of chaos, there is also opportunity.” This rang particularly true over the past few years. Undoubtedly, the semiconductor chip emerged heroic from the chaos of pandemic times, underscoring...
UMC Becomes #3 Foundry TrendForce reports that UMC is expected to overtake GlobalFoundries as the world’s #3 foundry this quarter (4thQ 2020) reportedly driven by strong demand for display drivers and power management chips. UMC revenue will be US$1.57 billion, with a global market share of 6.9%, compared to GlobalFoundries’...
Scientech to provide local sales, manufacturing and support of YES products in Asia FREMONT, Calif. – Dec 7, 2020YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and AR/VR applications, today announced that it has signed an agreement with its Taiwan-based partner...
The market for high bandwidth memory (HBM) is projected to grow 49% in wafers, including DRAM and logic layers, from 2020 to 2024. Growth is driven by increased adoption in high-performance computing such as AI, networking, graphics, and future server processors. Solutions to package HBM plus logic include silicon interposers...
In September of 2018, I spoke with KLA’s Stephen Hiebert and Pieter Vandewalle about the changing advanced packaging landscape, and the need for better process control that inspired the company’s foray into the advanced packaging space. With the introduction of its IC packaging portfolio that comprised the Kronos™ 1080 and...
Over the past few years, we’ve seen KLA evolving from its origins as a process control company focused on front-end solutions, to a more holistic organization that extends its reach into more segments of the electronics chain, like, packaging, display, and components. The ICOS inspection product line got it pointed...
If TSMC’s Doug Yu wrote a rap song, the title would be “HIT IT!” He’s been on a roll lately, evangelizing heterogeneous integration technology (HIT) as the new path going forward for the semiconductor industry. In fact, the ECTC 2020 keynote is Yu’s third keynote presentation at key h this...
At the latest MEPTEC Luncheon, held February 5, 2020, and hosted by SEMI at its Milpitas HQ, Google’s Dr. Preeti S. Chauhan, Technical Program Manager for Data Center Quality, presented her perspectives on the benefits and challenges of advanced IC packaging technologies. Considering that Alphabet, Google’s parent company, controls about...
The November Issue of Chip Scale Review contains some interesting advanced packaging information that is worthy of sharing in IFTLE: the cover story on fluxless µbumping by ball placement, and Yole’s look ahead at stacking technologies. Fluxless µBumping by Ball Placement CC Dong from Air Products examined fluxless micro ball...
This was my first Electronica, and all I can say is – It is massive. It covered everything to do with the electronics supply chain, from chip design to the chip itself, to the package, component, subassembly, circuit board, through to test and measurement, and enclosures, switches, the works. While...
