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SEMICON West Smart MedTech Panel: Design Verification in the Supply Chain

All electronic products begin with design be it a single chip, a collection of chips or chiplets such as 3D-IC, or a system based on heterogeneous integration. Ditto for verification, which is now a far more important component of the design flow and one that impacts the entire electronic product...

Understanding Wafer Applications in Surface Metrology

This detailed blog covers how wafers are manufactured and processed, what makes a perfect wafer, and which surface metrology approaches can be used for quality assurance. First… the manufacturing process Microelectronic components and semiconductors are manufactured on round thin discs, referred to as wafers. Wafers can be made of various...

Metrology in Advanced Packaging

With the dawn of chiplet integration, advanced chip manufacturing and advanced packaging technologies are more complex than ever. Dies are being integrated from different wafers, and yield management is tricky. It requires a combination of both electrical test and optical measurement – or metrology. Even more, it requires hybrid metrology...

Figure 2: The DNP glass interposer measures 40 x 40mm.

IFTLE 510: DNP Glass Interposer; Samsung/Amkor team for H-Cube

JISSO JOINT consortium In late 2019 Showa Denko bought Hitachi Chemical (HC) for about $8.9B. HC had an operating income of about $440 million on sales of $6.3B with about 40% of its sales from materials, including chemical mechanical planarization slurries, epoxy compounds, and anode materials for lithium-ion batteries. The...

What Does the Future Look Like for Microelectronics Events?

In a global industry that relies heavily on collaboration, COVID 19 created a big pause and pivot in one of the key business development tools of the microelectronics industry: technology conferences and trade shows. Organizations like IMAPS International and SEMI, which rely on the revenue generated by these events to...

The Most Wonderful Time of Year for A Semiconductor Technologist

It’s December, and a busy three weeks of conferences until most of the semiconductor industry takes a short, two-week respite, or at least slow down, while Christmas, New Year’s, and other holidays are celebrated across the globe. Historically, for me the next two weeks have been one of my favorite...

When the Small Become Mighty: Sensors Fuel Transformation in Mobility

Connectivity. Electrification. Shared Mobility. Autonomous Driving. McKinsey & Company cites these four disruptive trends behind future mobility — dynamics that could help to transform the quality of life for hundreds of millions of people. McKinsey & Company predicts that by 2030, mobility innovation could dynamically alter everything from safety in...

MEPTEC’s Annual IC Packaging Industry Update

Ira Feldman welcomed about 100 attendees to MEPTEC’s December luncheon at SEMI Headquarters to hear Jan Vardaman, Founder and President of TechSearch International deliver her annual “State of the IC Packaging Industry” address titled, “Market Drivers for Advanced Packaging: 2020 and Beyond.” In her opening statement, Vardaman emphasized that our...