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The semiconductor industry is acting quite young for its age. And that’s just not me saying it; over and over again during SEMICON West 2017 I heard some variation of the phrase “We’re just getting started.” What was it that accounted for the upbeat and buoyant mood at SEMICON West...
Last June, AMD made 3D integration history with its introduction of the Fiji gaming processor unit (GPU), which for the first time put high bandwidth memory (HBM) — a true 3D stack integrating memory die with through silicon via (TSVs) — into production. Fiji is a Si interposer-based module comprising...
For many years now, the semiconductor industry development has been governed by Moore’s law and the increasing demand for higher performance and lower manufacturing costs. Under this context, the “More than Moore” company, Yole Développement (Yole) has identified a strong interest for panel-level packaging technologies. “At Yole, we saw a...
Phoenix AZ – May 8, 2015 – 3D InCites, the premiere online content source for reliable 3D technology information, today announced Scott Jones, director, Alix Partners, will deliver a keynote address titled How 2.5/3D Technologies Will Shake Up the Semiconductor Supply Chain and Cost Structure at the third annual 3D...
San Jose, CA (May 7, 2015) — SEMI today announced the SEMICON West 2015 technical and business program agenda tackling the most important issues facing the future of semiconductor manufacturing. In addition to the exposition, with over 650 exhibitors planned, SEMICON West will feature over 180 total hours of programs —...
On Thursday and Friday of last week, Monterey, California’s previous state capital, became the center of presentations and discussions about IC design challenges as well as latest innovations / progress made in the field of EDA tools and IC design methodologies at Electronic Design Process Symposium (EDPS) 2015. We also learned a...
Despite efforts to leverage the one hour time difference from Phoenix to San Francisco to my advantage, I arrived on the scene at the 2014 3D ASIP Conference to find the morning Pre-conference Symposium on (Interposer) and 3D Design Tools and Flows already well underway. My absence did not go...
I don’t know why it still surprises me to read conflicting reports on the progress of 3D TSVs. But I think Ron Huemoeller, Amkor, finally hit on it in his closing remarks during today’s webcast, “TSV Packaging at the Tipping Point”, moderated by Pete Singer, Solid StateTechnology/Extension Media. Huemoeller’s presentation and...
BOISE, Idaho, Sept. 25, 2013 — Micron Technology, Inc. announced that it is shipping 2GB Hybrid Memory Cube (HMC) engineering samples. HMC represents a dramatic step forward in memory technology, and these engineering samples are the world’s first HMC devices to be shared broadly with lead customers. HMC is designed...
In the world of semiconductors and microelectronics, a trend to vertically stack integrated circuits (ICs) or circuitry has emerged as a viable solution for meeting electronic device requirements such as higher performance, increased functionality, lower power consumption, and a smaller footprint. The various methods and processes used to achieve this...
