Matches for your search: "hybrid bonding "
Let’s catch up on what we missed among our community… Cadence completed the acquisition of the SerDes and memory interface PHY IP business from Rambus. At ISES EU Power in Italy, Dr. Stefan Pieper, Global Application Manager for Semiconductor, spoke about electroless metallization for power semiconductors and introduced MKS’ Atotech’s...
The semiconductor and microelectronics industries are in the midst of a workforce crisis created by, among other things, the combination of explosive growth and a maturing workforce. Competition for STEM talent in other industries has made it difficult to recruit the latest generation of graduates, who are lured by seemingly...
Tokyo Electron (TEL; Head Office: Minato-ku, Tokyo; President: Toshiki Kawai) today announced the launch of Ulucus™ L, a laser edge trimming system for 300ｍｍ wafer-bonded devices. Ulucus L is a laser edge trimming system that integrates an advanced laser control unit with LITHIUS Pro™ Z, TEL’s widely recognized coater/developer platform....
Advanced packaging has continued to evolve with various interconnect technologies on their way towards heterogeneous integration. Different assembly processes are used to optimize the yield of advanced packages, while the development of innovative advanced packaging materials is needed to address the many challenges faced in the assembly process for System...
EVG Academy doubles the amount of training space and technical trainers; provides training on every class of EVG equipment and software EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology, and semiconductor markets, today announced that it has established the EVG Academy, a...
I cannot say I enjoyed this year’s COVID 19 version of ECTC 2020, but I guess it was better than nothing. I will leave the discussion of what I would like to see improved in the software package for the organizers. Let’s first take a look at three key papers...
3D InCites presented the 2019 process of the year award to Eric Beyne and Arnita Podpod of IMEC for their flip-chip on fan-out wafer-level package (FC on FOWLP) process that avoids the use of TSVs in active chips to achieve high-density packaging. Advanced packaging practitioners may have noticed the similarities...
We hit the exhibits at IWLPC 2019 with a vengeance this year. Our mission was twofold – to find out the latest supplier offerings to support technology trends, and to spread the word about our new community membership opportunities on 3D InCites. But I’ll get to that part in a...
MEPTEC lunches, now known as the MEPTEC / IMAPS / SEMI Semiconductor Speaker Series Luncheon sponsored by Chip Scale Review, are on again in Silicon Valley. At the most recent lunch in mid-March 2018, I was pleased to see that it was none other than Rich Rice, VP Business Development,...
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has received an order from the University of Tokyo for its EVG810LT plasma activation system for compound semiconductor research. Installed at the university’s Takagi & Takenaka Laboratory, the...
