Search Results

Matches for your search: "hybrid bonding "

EV Group Revolutionizes 3D Integration from Advanced Packaging to Transistor Scaling with NanoCleave Layer Release Technology

Sep 12, 2022

IR laser cleave technology enables nanometer-precision layer transfer through silicon, eliminating glass substrates for advanced packaging and enabling thin-layer 3D stacking EV Group (EVG), a leading provider of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced NanoCleave™, a revolutionary layer release technology for silicon...

SEMICON West 2022: 3D InCites Member Company Preview

Jun 30, 2022

Sustainability, smart technologies, and workforce development will take center stage at SEMICON West 2022 Hybrid, July 12-14 at the Moscone Center in San Francisco. More than 200 industry leaders, visionaries and technology experts will be on hand to network and showcase the industry’s newest technologies and products while sharing insights...

Easing the 3D IC Pain at IMAPS DPC 2013

Mar 25, 2013

In his keynote address at this year’s IMAPS Device Packaging Conference (IMAPS 2013) Sitaram Arkalgud, of Invensas, touched on a number of remaining technology “choke points” that need to be addressed before high volume manufacturing of 3D ICs can take off. Obligingly, a number of presenters following his talk offered balms...

More Tech Notes from 3D ASIP 2012

Jan 08, 2013

Oh yes, where was I before the holidays took over and hijacked my life for two weeks?  I’ll bet you thought I was done reporting on 3D ASIP, but wait – there’s more! Point/Counterpoint on Thin Wafer Handling I already reported on Wilfried Bair’s (Suss MicroTec’s perspective on temporary/ debond...

Leti’s Open 3D Targets Niche Market Players

Jul 02, 2012

Last week, CEA-Leti launched its Open 3D initiative to the 3D world in an effort to make its mature 3D technologies accessible to industrial and academic partners for their advanced products and research projects. Wanting to learn more about this offer than was detailed in the press release, I interviewed...

Perspectives on 3D Integration: The Researchers

Oct 13, 2011

To listen to John Lau, of ITRI, speak on the topic of 3D integration is to experience a passion for technology that rivals no other; except perhaps that of Rao Tummala of Georgia Tech.  But John is definitely more vocal in his passion. Rao has a softer, gentler approach.  At...

ECTC 2011 – It’s a Small World After All

Jun 13, 2011

I ask you, could there be a better place to host a conference dedicated to micro and nano electronics than Disney World, the place where all things are possible? This year’s event boasted the greatest turnout so far, (over 1000 attendees) and had such an abundance of papers that the...

TSVs: just the tip of the 3D ICeberg

Jun 06, 2009

At ECTC last week, I counted at least 21 presentations dedicated to TSVs alone, and 13 dedicated to other processes for 3D IC integration. The sheer volume and depth of research required around bringing these technologies to market is sometimes lost on those of us who sit outside the circle...