Search Results

Matches for your search: "hybrid bonding "

ERS electronic Releases Fully Automatic Luminex Machines with PhotoThermal Debonding and Wafer Cleaning

May 29, 2024

ERS electronic, the industry leader in thermal management solutions for semiconductor manufacturing, is announcing two new fully automatic machines from its Luminex product line. The machines, LUM300A1 and LUM300A2, are designed to handle 300 mm substrates, and both feature ERS’s state-of-the-art PhotoThermal debonding technology that offers unparalleled flexibility, cost-effectiveness, and...

VPT Components and MRSI Systems Jointly Address Manufacturing Challenges

May 31, 2022

By Al Russo (VP of Engineering), VPT Components, Irving Wang and Jon Medernach, MRSI Systems VPT Components is one of the largest providers of JAN certified semiconductors along with a full-service facility for the independent, unbiased testing and custom assembly of electronic components. Its product portfolio includes MIL-PRF-19500 qualified Rad...

FINETECH Debuts NEW FINEPLACER FEMTOBLU Micro Assembly Cell for Photonic Component Assembly

Sep 14, 2020

FINETECH, a leading provider of precision bonders and advanced rework equipment, announces the latest addition to the FINEPLACER® family, the FINEPLACER® femtoblu bonding system. This automated micro assembly cell is an efficient and economical solution for dedicated photonic production. These demanding applications will benefit from a placement accuracy of 2.0 µm @...

Talking Nerdy with Exhibitors at IWLPC 2018

Nov 01, 2018

With heterogeneous integration, 3D, and advanced wafer-level packaging technologies officially declared the rising stars of the semiconductor industry, materials, process and equipment suppliers have pulled out their shiniest bells and whistles. Here’s a sampling of news and products that were on display at IWLCP 2018, October 23-25, 2018 at the...

MRSI Systems’ MRSI-HVM3P Extends The MRS-HVM3 Die Bonder Family to New Applications

Aug 21, 2018

BILLERICA, Massachusetts, USA, August 20, 2018 – MRSI Systems (Mycronic Group), is expanding its leading high-speed MRSI-HVM3 die bonder platform with the launch of the MRSI-HVM3P to offer configurations for active optical cable (AOC), gold-box packaging, and other applications in addition to chip-on-carrier (CoC). This expansion is in response to our...

MRSI Systems Launches High-Speed Die Bonder for Photonics High-Volume Manufacturing

Aug 18, 2017

BILLERICA, Mass., August 14, 2017 – MRSI Systems, a leading manufacturer of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems, is launching a new High-Speed Die Bonder, MRSI-HVM3, to support our photonics customers’ high volume manufacturing requirements. The MRSI-HVM3 is in full production and we are shipping to...

The Advancement of Device Packaging – A Resume on IMAPS DPC 2017

Apr 17, 2017

As part of the organizing committee, we believe this year’s IMAPS Device Packaging Conference really fulfilled what the announcement promised – the largest conference dedicated to the full spectrum of 3DIC and packaging, fan-out technologies and MEMS/sensors. We enjoyed 12% attendee growth over 2016, welcoming nearly 600 attendees from 20...

Semiconductor Supplier Updates from SEMICON West 2015

Jul 27, 2015

No SEMICON West would be complete without a few laps around Moscone North and South, and some one-on-one chats with suppliers. I stopped in to see several semiconductor supplier companies who annually request an audience with the Queen of 3D to talk about their latest accomplishments, as well as gain...

The Back Story on Besang’s True 3D ICs

Nov 07, 2013

BeSang Inc, a fabless semiconductor company in Beaverton, OR, has been on my 3D IC radar since 2008, when I first edited a 3D technology cover feature in Advanced Packaging Magazine, written by George C. Riley, that included a status report on BeSang’s TRUE 3D ICs™, which had just been...

2022 3D InCites Awards Winner Circle

Mar 17, 2022

2022 3D InCites Awards Winner Circle The 2022 3D InCites Awards program recognized industry-wide contributions in the development of heterogeneous integration and 3D technologies. In 2021, we added two awards to recognize companies that demonstrate best practices in sustainable manufacturing efforts, as well as diversity equity and inclusion (DEI). Below are the...