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Oh, how I missed those hallway conversations! And last week’s IMAPS International Symposium 2021 did not disappoint. It was so energizing to reconnect face-to-face with those industry colleagues who were able to make the trip. While the keynotes and sessions provided great insight on technology trends impacting the microelectronics industry,...
Rarely do I have the opportunity to visit a company two times and find something new to write about, never mind three. But as always, EV Group didn’t disappoint for my visit Friday (January 17, 2014) to see the company’s latest additions, both to the physical plant and to the product...
This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. After my interview with imec’s Ludo Deferm, I met up with Andrew Ho, global industry director, advanced semiconductor materials, for Dow Corning’s Electronic Solutions, to get an update on Dow Corning’s developments in...
At last week’s SEMATECH technology round-up webcast, Sitaram Arkalgud, director of 3D interconnect, made a comment about 3D technologies that, in my opinion, really brought all the issues swirling around it to one vital point. It was this: as a platform, 3D allows a whole other scheme of processes to...
At RTI’s 3D ASIP last week, I sat down with Paul Enquist, of Ziptronix, to get an update on the company’s progress with its direct bonding technologies. Paul presented on Day 2 of the conference, but honored me with a one-on-one explanation on the application space enabled by the company’s...
Ziptronix, Inc. has signed a licensing agreement with Sony Corporation for the use of Ziptronix’s patents regarding oxide bonding technology for backside illumination imaging sensors. “We believe that Ziptronix’s patented oxide bonding technology, called ZiBond™, enables the industry’s lowest distortion for imaging systems utilizing backside illumination” said Dan Donabedian, CEO...
It’s a good story that’s been 30 years in the making. From its founding by Erich and Aya Maria Thallner in 1980 and subsequent launch of the world’s first double-sided mask aligner for the emerging MEMS market five years later; to its most recent industry-first launch of a fully-automated wafer...
My recent visit to EV Group at its headquarters in Schärding, Austria, included some time spent with M. Jürgen Wolf, who, as part of his management and coordination of Fraunhofer IZM-ASSID (All System Silicon Integration Dresden) is the program & project manager for 3D Wafer Level System Integration (WLSI) and...
As the old saying goes, things usually happen in threes… and in this case 3D. Three years ago, EV Group (EVG) teamed up with Brewer Science, Inc. (BSI) to develop temporary wafer bonding and debonding processes using EVG tools and BSI's materials. Just a few weeks ago, CEA Léti...
A walk across the impressive Bernin, France campus that is home to two of Soitec Group’s three divisions takes you past three production-level fab facilities – aptly named Bernin 1, Bernin 2, and Bernin 3, plus a development facility. The company’s three-stage business model encompasses innovation, licensing, and production...
