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Melville, NY (July 7, 2021) – Micross Components, Inc. (“Micross”), a leading global provider of mission-critical microelectronic components and services for high-reliability aerospace, defense, space and industrial applications announced the expansion of its Hybrid and assembly business with the acquisition of assets of the microelectronics business from Ultra CEMS (“Ultra”),...
The team at EV Group has done it again. They looked around at where the microelectronics industry is headed, identified a gap and set out to fill it. This time, the gap fell in between research and development (R&D) and the ramp to manufacturing for customer products built using heterogeneous...
The San Francisco Hilton on O’Farrell Street welcomed IEDM 2019 and it’s 1800 attendees in early December. While the conference name implies its focus to be the International Electronic DEVICES Meeting, I was glad to see that IEDM looked again way beyond devices into application-specific topics and system-level challenges of...
Sitaram Arkalgud, VP 3D technologies, Invensas, provided the entertainment at last week’s IWLPC 2015. As soon as he realized Phil Garrou wasn’t in attendance, he reverted to using the 2.5D terminology, despite the fact that on numerous occasions, I have voiced my disdain for the term, preferring “interposer integration.” Arkulgud...
In July and August schools are closed and many people like to take vacation. Typically nothing major happens during these months. Not this year! It was a lively August, if you consider the recent “adjustments” in the stock markets worldwide as a series of events disrupting the summer doldrums. But...
Remember SEMICON West 2012? How could you forget? It was all clubbing with your customers at The Redwood Room, DNA Lounge, and The Endup after a few standout meals with them at Mission Chinese Food, Slanted Door, Wayfare Tavern, Acquerello, and Absinthe that were preceded by a few drinks with...
Some technologies take forever to cross the chasm into successful commercialization. Or they never do, and end up together with Wile E. Coyote at the bottom of the canyon. My take today is that heterogeneous integration is showing signs of a successful chasm leap. Heterogeneous integration is going to be the...
Big news for 3D ICs this week as TSMC and its OIP Ecosystem Partners announce the release of silicon-validated reference flows for both 3D IC stacks and 16nm FinFETS (everyone else puts the 16nm FinFETS first, but I’m most excited about the 3D IC news.) According to Peter Clarke in...
Not long after posting 3D IC Reality Check on Tuesday, I discovered that I missed one. If you haven’t read the post by SemiMD’s Mark Lepedus, Industry Inches Towards 3D Chips you should. While its got some similar information about recent announcements from GlobalFoundries as was in Rick Merritt’s post in EETIMES, it has...
2024 3D InCites Technology Enablement Awards Finalists For the 2024 3D InCites Awards, we decided to change things up a bit and do away with our standard categories from previous years. Instead, we will be awarding five Technology Enablement Awards to companies who have identified a challenge in the adoption...
