Matches for your search: "hybrid bonding "
Expanded collaboration includes installation of EVG’s LITHOSCALE® maskless exposure system, EVG®7300 UV-NIL system and complementary resist processing systems FLORIAN / GRAZ, Austria, November 13, 2023—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and Silicon Austria Labs (SAL), Austria’s leading...
CHIPS Act Innovation Hubs SEMI has published an interesting article where they predict 10 likely locations for CHIPS Act Innovation Hubs. Aside from the CHIPS Acts $52B in subsidies for American chipmakers and 25% tax credits for capital expenditures, the Department of Commerce is also allocating $10B (over five years)...
Samsung Foundry SAINT-S Samsung Foundry revealed their SAINT-S technology for SRAM on logic 3DIC, at the recent IMAPS Device Packaging Conference, and it is certainly worthy of a closer look. As shown in Figure 1, it is an SRAM on Logic 3DIC with 4µm TSV on 50µm pitch. It consists of...
At Laser World of Photonics in Munich, Finetech will present the successor of its acclaimed sub-micron bonder for research and development. Technological innovations make the high-precision placement and assembly system the ideal starting point for cost-efficient and fast development of optoelectronic products. As a manufacturer of micro assembly equipment and...
The annual International Electron Devices Meeting (IEDM) presents the latest developments in electronic device technologies focused on advanced scaling, heterogeneous integration, quantum computing, and wide bandgap devices. Among several excellent papers on 3D integration were two papers on 3D sequential integration, long the holy grail of 3D integration because of...
SAINT-JEOIRE, France – Jan. 15, 2016 – SET, Smart Equipment Technology, the leading supplier in high-accuracy die-to-die and die-to-wafer bonders, today announced its participation in the 3D integration consortium of IRT Nanoelec, which is headed by CEA-Leti. SET joins Leti, STMicroelectronics and Mentor Graphics to develop advanced 3D die-to-wafer stacking...
ST. FLORIAN, Austria, July 30, 2015—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has received a 2015 3D InCites Award for its GEMINI®FB XT automated fusion wafer bonder in the category of 3D manufacturing equipment....
A second side trip on the way to DATE 2015 brought me back to Nimes, France to check up on activities at Fogale Nanotech since last year. I was reminded once again, that Fogale isn’t just a semiconductor equipment supplier. Its core competencies are optical and capacitive sensing technologies, and thanks to...
It’s been a long time coming, but Kulicke & Soffa has seen the writing on the wall, and it reads: “2.5D and 3D IC assembly is a hot market.” Why else would the wire-bond giant invest in developing a thermocompression chip-to-substrate (C2S) bonder for high-volume 2.5D and 3D IC die...
Moore’s law is approaching physical limitations of CMOS scaling, and three dimensional (3D) integration technologies have been proposed as solutions. Wide band transmission between logic and memory is becoming indispensable for not only mobile products, but also other products related to network systems such as servers and data centers. These...
