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Plus: UCIe 2.0 for 3D stacking; Samsung slows down Texas expansion Nvidia’s Blackwell Experiences Delays Nvidia’s Blackwell AI chip is reportedly facing significant delays due to several issues discovered late in its manufacturing cycle. Reportedly, one problem is with the processor die connecting the...
Adeia Inc. (Nasdaq: ADEA), a leading innovator in research and development who has pioneered hybrid bonding in the semiconductor industry, has chosen PulseForge photonic debonding equipment for advanced heterogeneous integration in semiconductors. The tool was installed at Adeia’s San Jose, CA, facility. “We are excited to partner with PulseForge and...
At last week’s International Microelectronics and Packaging Society’s Device Packaging Conference, (IMAPS DPC 2024) we didn’t need TrendForce to tell us that advanced packaging is the hottest technology in the semiconductor industry. We just needed to look at the record attendance of more than 700 advanced packaging enthusiasts who turned...
A little over a year ago, I wrote a Knowledge Portal entry about the cost of 3D ICs. Here I am again to tackle the issue of 2.5D and 3D cost reduction from a slightly different angle. This entry is based on what SavanSys presented at IMAPS Device Packaging 2016....
Two years ago, I visited EV Group’s world headquarters in Schärding, Austria, and wrote about what they call their Triple I approach to success. Triple I stands for Invent, Innovate, Implement, and refers to EVG’s mission of getting into whatever market they target at the ground level, investing 20% of...
The supply chain business model for manufacturing 3D stacked ICS has caused perhaps one of the hottest debates so far in commercializing 3D semiconductor processes. It’s easy to see why. Beyond the rather obvious question of who will own the liability of damaged devices, there’s a good deal of revenue...
SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor and related markets, launched the XBS300 Temporary Bonder, SUSS MicroTec's latest generation of high volume manufacturing temporary bond systems. This Bond Cluster is configured to temporarily bond 200mm and 300mm wafers for 3D integration applications as well...
There’s no doubt about it, the 3D technology related workshops, lectures, and presentations happening at and around SEMICON West this year are plentiful and varied. There’s something for everyone: 3D metrology, 3D interconnect and standards development; 3D IC co-design, 3D bonding and thin wafer handling, 3D test solutions, commercialization of...
SUSS MicroTec and Thin Material cooperate on a temporary bonding process that simplifies the debond process by eliminating a number of steps thus saving time and lowering device costs.
EV Group (EVG) and Applied Materials, Inc. announced a joint effort to develop wafer bonding processes for the manufacture of TSVs for 3D IC packaging applications. The two companies will be working together as members of the EMC-3D Semiconductor 3D...
