Matches for your search: "hybrid bonding "
At this year’s IEEE International Electron Device Meeting, [IEDM] (December in San Francisco) SK hynix gave an interesting look at “Advanced Packaging Technology in Memory Applications for Future Generative AI Era”. [Generative AI creates new content through the use of machine learning models such as generative adversarial networks. Such frameworks...
Semi Analysis has detailed their thoughts on the current GPU shortage. We all know that AI technology is upon us. This will require massive amounts of GPU computing. Semi Analysis recently noted that GPU sales are skyrocketing and they see companies scrambling to stockpile inventory. For example, OpenAI is reporting...
Preparation for the 73rd ECTC started one year ago and was strongly supported by over 250 experts from 15 countries, members of 10 technical committees. The technical committees critically reviewed 618 submitted abstracts from industry (56.1%) and academia (43.9%), resulting in 369 technical papers. The papers, organized in 41 sessions,...
This is by far my favorite blog post to write each year; the one where I get to announce the winners of the 3D InCites Awards. This year we had 36 nominees for 10 2023 3D InCites Awards categories, representing companies from around the world, all working to advance the...
This week we continue our look at the IPC Advanced Packaging Symposium: Building the IC-Substrate and Package Assembly Ecosystem, held in Washington, DC in October. Being the IPC, we could — and should — expect a focus on high-density laminates (HDL) and high-density build-up substrates (HDBU); but they also brought...
Every now and then you run across a paper or presentation, and you say to yourself, “This clearly explains this or that technology…this is an important paper”. When I do that, I try to share them with you on IFTLE. In this case, I’m talking about the paper “2.3D Hybrid...
SEMI, together with FlexTech, the MEMS & Sensors Industry Group, the Nano-Bio Materials Consortium (NBMC) and NextFlex, held FLEX/MSTC 2020 at the DoubleTree in San Jose from February 24 to 27. Executives from above industry organizations and their member companies presented current capabilities of flexible hybrid electronics (FHE), MEMS and...
If you drive a late model car, you may be impressed by the many sensors that capture engine conditions, tire pressure, etc. and report to you. Many cars even call the factory if they need preventive maintenance. Wouldn’t it be great if we could one day show the same preventive...
Let’s start with the indoor rainstorm. I arrived at the Swan and Dolphin in Orlando just in time for the fan-out plenary session of ECTC 2017, so tossed my stuff in my room and headed on in (wearing jeans, no less!) You can read about that here. Afterward, I had...
2023 3D InCites Awards Winner Circle The 2023 3D InCites Awards program recognized industry-wide contributions in the development of heterogeneous integration and 3D technologies. In 2021, we added two awards to recognize companies that demonstrate best practices in sustainable manufacturing efforts, as well as diversity equity and inclusion (DEI). Below are the...
