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Next week the top global event for Advanced System-in-Package technologies comes to Sedona. Combining the 3D ASIP and IMAPS SiP events into an all-in-one comprehensive program, IMAPS established the Advanced System-in-Package conference to focus exclusively on innovative SiP technology developments, solutions and business trends. Advanced SiP 2022 will be a...
I think it was Shakespeare who reportedly penned, “Would a rose by any other name still smell as sweet?” or something close to that. Why am I quoting Shakespeare? Well, we have a technology, massively parrallel pick-and-place assembly, that’s been around for more than a decade that I think still...
Because IMAPS is a society, there is a strong community aspect to its events. It was good to see that captured at this year’s symposium. I really enjoyed attending the live versions of the Society Awards presentation and the Diversity and Inclusion Roundtable. I also popped into the Student-Industry Roundtable...
I was halfway through my post about my day at Virtual SEMICON Taiwan, when I realized that to do the Global SiP Summit justice, meant it would need its very own post. The live version of the event spanned three full days. That’s a lot of content. While the on-demand...
This week we continue our look at ECTC 2020. imec and SPTS Collaborate on Nano-TSV Processes As part of our IFTLE theme of advanced packaging and interconnect going submicron, let’s look at the imec (long renowned for both their front end and back end work) presentation “Extreme Wafer Thinning and...
Severine Cheramy has devoted her career to developing 3D integration technologies and bringing them to market. She was the first person to show me what a TSV wafer looked like when I visited CEA-Leti’s cleanroom in 2009 during my Tour de France in 3D. At the time, she was a...
Looking back at the last 10 years, it is very difficult to choose one single event that was the most pivotal for commercializing 3D integration technology. There have been many prior events that have driven 3D integration and aligned the whole industry in migrating from monolithic 2D to heterogeneous and...
Just in case you didn’t have a chance yet to read part 1 of the ISS 2019 blog, covering day 1, it’s posted here. Technology and Manufacturing Trends Day 2 started with a keynote about the magic nanodevices can create, delivered byJo de Boeck, imec’s EVP and chief strategy officer. He emphasized that...
During the 2015 European 3D TSV Summit, I drove attendees to distraction by asking each presenter what success looked like to them for 3D integration. The resulting responses became a blog post, What Does Success for 3D Integration Look Like? Now, a year later, I decided to revisit the topic by...
Why DID you miss your 2014 3D Stacked DRAM equipment shipment forecast? And what’s different about the outlook for 3D Stacked DRAM equipment shipments in 2015? Briefly, as presented in Part 1 of this thread, significant structural problems existed in the DRAM industry, present from the very beginning of 2012, that...
