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If you’re new to the advanced packaging industry, it may have crossed your mind to invest in a professional development course. IMAPS, or the International Microelectronics Assembly and Packaging Society, offers exactly that. Their packaging-specific, IMAPS Academy courses are aimed at promoting a stronger understanding of key parts of the...
ESCONDIDO, Calif. – August 16, 2021 – QP Technologies™ (formerly Quik-Pak), a leading provider of innovative microelectronic packaging and assembly solutions, today announced it has installed two new Hesse Mechatronics ultrasonic wire bonders at its wholly owned 20,000-square-foot facility. The fully automated bonders allow QP Technologies to provide more advanced...
iMAPS: Enabling a Connected World: Always On! 3D InCites will be participating in the iMAPS 2020 virtual symposium, October 5-8, 2020. Come check out our virtual profile to learn more about our community membership and 2021 editorial and marketing opportunities. We have compiled a list of papers, presentations and exhibitor...
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and IBM (NYSE: IBM) today announced that the companies agreed to sign a license agreement on laser debonding technology. EVG plans to integrate IBM’s patented Hybrid Laser Release process into EVG’s...
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled its next-generation laser debonding solution, which enables high-throughput, low-cost-of-ownership (CoO) room-temperature debonding for ultra-thin and stacked fan-out packages. Designed as a module for integration in the company’s benchmark EVG®850...
The industry standard interconnect technology for fine-pitch 2.5D assembly and 3D stacking is thermocompression bonding of solder capped μbumps. This technology has several challenges which have limited widespread adoption in high-volume production. While the implementation of the technology at 40μm pitch is already challenging, the likelihood of extending this technology...
ST. FLORIAN, Austria – Feb. 5, 2016 – EV Group (EVG), an industry-leading supplier of wafer-bonding, lithography/nanoimprint lithography (NIL), metrology, photoresist coating, cleaning and inspection equipment, today announced its participation in the 3D integration consortium of IRT Nanoelec, which is headed by CEA-Leti. EVG joins Leti, STMicroelectronics and Mentor Graphics...
In its fourth edition and with a new name, the European 3D Summit (formerly the European 3D TSV Summit) reflected the shift from R&D to the real business of 3D integration and advanced packaging, and highlighted the significant growth this market space has undergone in the past year. It has...
Garching, September 17, 2015 – SUSS MicroTec, a global supplier of equipment and applications for the semiconductor industry and related markets, has launched the new bonding platform XB8 today. The XB8 wafer bonder is designed for a wide range of bonding processes. It supports substrates with a wafer size of...
There is no rest for the weary. Just because we can finally declare that 3D ICs are in production doesn’t mean we’re done working on it. To the contrary, efforts are ongoing at research institutes like imec in Belgium and Leti in France to take 3D integration to the next...
