Matches for your search: "hybrid bonding "
Interconnect reliability is critical to the reliability of semiconductor packaging and electronic systems. If we look at the life cycle from the chip to the system—from IC design, wafer fab, and packaging, to board assembly and system integration—the common element is the “interconnect thread” for the reliability of the electronic...
Justus Liebig University Giessen to Use the Dual Platform for Next Generation microLED and Photocatalysis Applications Plainview, N.Y., October 12, 2022 – Veeco Instruments Inc. (Nasdaq: VECO) announced today that it has received an order from Justus Liebig University Giessen (University of Giessen) for an integrated GENxplor® R&D Molecular Beam...
The IMAPS 2021 program is set to be knowledge-packed, offering materials both in person and on demand, including keynote presentations from top experts, professional development courses, numerous technical sessions and over a dozen posters. Our 3D InCites community members are playing a large role in dispersing this knowledge through their...
The 2017 3D InCites Awards program has turned out to be the most exciting yet! We had as many as seven nominees in some fields (supplier of the year), and tallied just over 17,529 votes in total! We also saw a considerable increase in nominees using social media to promote...
SAN JOSE, Calif. — Ziptronix, Inc., a wholly owned subsidiary of Tessera Technologies, Inc. (NASDAQ:TSRA) (“Tessera” or the “Company”) and the leader in low temperature wafer bonding technology, today announced it has entered into a development agreement with Fraunhofer IZM-ASSID (“Fraunhofer”). The companies will work together to integrate Ziptronix Direct...
A few weeks ago, Tezzaron announced its latest industry first: an eight-layer 3D IC wafer stack containing active logic, built at its fab, Novati Technologies, a global nanotechnology development center located in Austin, TX. Novati is clearly on a roll, because today they added another industry first to their product...
SEMATECH’s story is one that is truly built upon the essence of collaboration. SEMATECH is not a traditional research center. Rather, it is a technology research consortium that exists to serve the best interests of its worldwide members and partners. Originally established in Austin, TX as an experiment in combining...
When will I learn that skirts and clean room tours don’t mix? And I always seem to be visiting EVG’s facilities when these situations arise. Yesterday at their Open House in Tempe, it wasn’t a clean room suit incident. It was the waffle floors with upward ventilation that almost caught...
SUSS MicroTec and IMEC have entered a joint development program to develop permanent bonding, temporary bonding and debonding processes for 3D system integration, including through-silicon-via (TSV) manufacturing.
Device of the Year InFO PoP – TSMC A device architecture that was developed and qualified for high volume production in record time. The announcement of its use in the A10 processor in September 2016 paved the way for fan-out applications to be used in mobile products in high volumes....
