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EV Group Brings Revolutionary Layer Transfer Technology to High-volume Manufacturing with EVG®850 NanoCleave™ System

Dec 07, 2023

Infrared laser cleave technology enables ultra-thin-layer transfer from silicon substrates with nanometer precision, revolutionizing 3D integration for advanced packaging and transistor scaling FLORIAN, Austria, December 7, 2023—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG®850 NanoCleave™...

Finetech Announces FINEPLACER® pico 2 Purchase by AmTECH Microelectronics

Sep 28, 2023

Finetech, a leading provider of precision die-bonders, announces the purchase of the FINEPLACER® pico 2 by AmTECH Microelectronics, a Silicon Valley provider of advanced microelectronics assembly and packaging services. The purchase of the FINEPLACER® pico 2 will advance AmTECH’s flip chip bonding and precision die bonding manufacturing services. Designed to...

IMAPS DPC Community Member Preview

Mar 09, 2023

The 19th Annual Device Packaging Conference (DPC 2023) is scheduled for next week, March 13-16, 2023, at the WeKoPa Conference Center, with an anticipated record number in attendance. The microelectronics assembly & advanced packaging event will bring together industry engineers, researchers and top experts participating in a multi-faceted technical program...

State-of-the-art Finetech FINEPLACER® Sigma Advanced Sub-micron Bonder Installed at Promex Santa Clara Facility

Feb 22, 2023

Finetech FINEPLACER® sigma bonder targets range of application-specific projects SANTA CLARA, Calif., Feb. 02, 2023 (GLOBE NEWSWIRE) — Promex Industries, a Silicon Valley–based provider of advanced design, packaging, and microelectronics assembly services, today announced the next key addition to its die-bonding service capabilities: a Finetech FINEPLACER® sigma advanced sub-micron bonder....

SEMICON Taiwan 2020 Hybrid to Lead the Way in AI and 5G Era

Sep 10, 2020

HSINCHU, Taiwan – September 10, 2020 – Advanced, smart, and green manufacturing will take center stage on-site and online September 23-25 as SEMICON Taiwan 2020 gathers industry visionaries and experts for the latest market trends, business opportunities, and innovations across the semiconductor supply chain. Bringing together 550 exhibitors across 2,000...

Understanding Heterogeneous 3D Integration

Jan 16, 2015

“How is heterogeneous 3D integration defined?” There are certainly different understandings in the microelectronics community regarding the definition of heterogenous 3D integration. In a very general definition, it is defined as the 3D integration of different devices such as a CMOS processor and a memory, for example. A more limiting specification would...

EV Group Celebrates Strong Growth and New Manufacturing Process Solutions at SEMICON West 2013

Jul 10, 2013

Demand For Flexible, High-Volume Manufacturing Solutions in 3D-IC/Advanced Packaging, MEMS, Power Device and Compound Semiconductor Markets Drive Growth SEMICON WEST, San Francisco, July 9, 2013— EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has achieved...

Mitsubishi Throws its Hat in the 300mm Wafer Bonding Ring

Jan 18, 2012

Earlier this week, Mitsubishi Heavy Industries, Ltd. announced it had “developed the world's first fully automated 12-inch (300 millimeters) wafer bonding machine, capable of producing 3-dimensionally integrated LSI (large-scale integration) circuits at room temperature.” This tool is targeted to the MEMS, 3D LSI's, and the RF market. I was skeptical...

Things are humming along at EV Group

Jul 27, 2011

“Keeping busy” doesn’t begin to describe what’s happening at EV Group these days. I sat down with Markus Wimplinger, Corporate Technology Development and IP Director, EVG,  at SEMICON West for a full briefing of the company’s latest corporate and technology developments.  Remaining true to their mission of “invent, innovate, implement”...