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Electronics Packaging vs. Advanced Packaging Electronics packaging is generally divided into three major areas, traditional packaging – also called standard or mainstream packaging, and sometimes even just “Others”: advanced packaging and emerging packaging technologies. Traditional packaging is everything with wire or ribbon bond interconnects on a ceramic, metal lead frame,...
Minneapolis, Minnesota — August 4, 2021 — CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D sensing technology solutions, will feature the WX3000™ metrology and inspection system with MRS™ sensor technology, and high-precision sensors for semiconductor tool set-up and diagnostics at the Virtual Connecting Heterogeneous Systems...
In recent blogs, we have discussed the damage done to Intel’s leading-edge technology reputation by major delays in both their 10nm and 7nm product introductions [ see IFTLE 458]. We have also seen them try to put a positive spin on the fact that they may have to go external...
I have finally been in this industry long enough to understand the cycle of discussion, scrutiny, call to arms, and discussions that emerging technologies go through on their way to adoption. What I first witnessed with the building of the 3D IC ecosystem, is now happening with chiplets. This past...
Several decades ago, Asia began its quest to be a reliable and cost-effective IC packaging, assembly, and test partner for low complexity ICs. Since then, Asia has proven itself as the world’s dominant wafer manufacturer and developer of process technologies, down to smallest feature sizes. On August 4, 2020, I...
About 50 years ago, I started my career as a system-level designer, focused on an interface card for the Siemens T 1000. It was the first electronic teletype, destined to ship in extremely high volumes all over the world. When Siemens ramped up production, they invited me to the factory...
When people weren’t talking about the coronavirus at this year’s 2020 IMAPS Device Packaging Conference and its co-located Global Business Council, they were talking excitedly about the arrival of the golden age of packaging, heterogeneous integration, and most specifically, chiplet integration. Keynote speakers (Doug Yu, TSMC; Christian Hoffman, Qualcomm Germany;...
What’s on the agenda for the 2020 IMAPS Device Packaging Conference (DPC)? So much, and too much to share it all. Our 3D InCites Community members and sponsors are playing key roles… Booth 56: StratEdge Corporation StratEdge Corporation, a leader in the design, production, and assembly of high-frequency and high-power...
3D very large system integration (3D VLSI) has many aliases. This high-density approach to 3D system integration first appeared on the scene as monolithic 3D (M3D), or as Leti dubbed it: sequential 3D. In 2014, the French research institute officially introduced it as CoolCube™ because this version of the technology...
With the continued innovations in packaging technologies and 2.5D interposers pushing 3D ICs further out from one end, and 16/14nm nodes already qualified without TSVs, making us wait until 10nm, are 3D ICs suddenly getting the squeeze from both sides? That’s one theory I took away from all the conversations...
