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On January 17, Finetech participated in the Massachusetts Institute of Technology’s (MIT) Integrated Photonics bootcamp, a week-long, hands-on learning experience at the MIT nano facility. The training allows participants to explore and learn to solve problems using lab equipment, preparing them for the challenges they will face in the workforce....
2017 saw a clear breakthrough for 3D chip technology in commercial products. Before then, the industry had looked rather skeptically at 3D, but now it is beginning to realize that 3D does not necessarily have to cost more money. Better still, it creates new possibilities and opportunities. 3D on...
Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. (Nasdaq: TSRA), announced today that Sandia National Laboratories signed a new license agreement for ZiBond® and Direct Bond Interconnect (DBI®) technologies. With this license Sandia will have access to the most advanced 3D integration technologies available, for use in a wide...
For the past 2 to 3 years, 3D integration technology has developed into a technically and economically interesting road for further improving the performance of systems. In comparison to conventional planar 2D systems, we are now able to fabricate shorter and faster connections between circuits. And we can make these connections...
Enhanced wafer alignment metrology capability coupled with market-leading GEMINI® FB system creates closed-loop fusion wafer bonding solution to enable high-density TSV devices St. Florian, Austria, July 8, 2013 — EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced...
Product Description Dow Corning temporary bonding solution is a bi-material silicone based technology featuring low cost of ownership and room temperature bonding and debonding. The chemical and thermally stable materials are spin-on type and can be use for wafer thinning down to 50um providing a global TTV of 2um on...
New Platform Member Further Strengthens Supply Chain for EV Group’s New ZoneBOND™ Capable EZR® (Edge Zone Release) and EZD® (Edge Zone Debond) Equipment Modules EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that Shin-Etsu Chemical Co., Ltd.,...
As chip-to-wafer (C2W) stacking has been identified by most technologists as the best approach to 3D stacking for optimum yields and the ability to stack dies of different sizes — especially in memory/logic stacks — a number of approaches have been or are being developed by various collaboratives. At IMAPS...
Company to share key developments and highlights at SEMICON West
EVG Systems Selected for Platform Flexibility, Functionality and Industry-Proven Reliability
