Search Results

Matches for your search: "hybrid bonding "

Veeco Announces Agreement With IBM to Explore WaferStorm Wet Processing System for Advanced Packaging Applications

Aug 14, 2024

Veeco’s WaferStorm® Wet Processing System to Enable Essential Cleaning Processes in Hybrid Bonding for IBM Veeco Instruments Inc. (NASDAQ: VECO) today announced that IBM selected the WaferStorm® Wet Processing System for advanced packaging applications and has entered into a joint development agreement to explore advanced packaging applications using multiple wet processing technologies from...

June Member News Highlights Semiconductor Design Tools, Collaborations, and More

Jun 26, 2024

This June, we’ve seen exciting strides in AI for semiconductor design, showcasing how AI and Digital Twin technologies are revolutionizing chip design and manufacturing. New software tools are boosting design and verification, and our members are driving innovation through key collaborations and contributions. From product development to workforce initiatives that...

Balancing Precision and Throughput in 3D Structures with Advanced Packaging and Motion Control

Apr 01, 2024

The relentless drive in the semiconductor industry to consistently deliver improved performance and power efficiency has traditionally led to increasingly smaller device geometries. However, these tiny footprint dimensions are starting to hit upon a process complexity and are becoming overly expensive to manufacture. Nobody can deny that keeping up with...

Community Member Monthly News – August 2023

Aug 30, 2023

News you may not have seen this month from our community members. Along with some upcoming participation to keep an eye on. Onto Innovation announced over $100 Million in orders for systems supporting advanced packaging for AI. Its Dragonfly® G3 sub-micron inspection and metrology system supports production of AI chiplet packages....

UPVfab Adds Micro-Transfer Printing Technology for Hybrid Photonic Integration

May 11, 2022

Massively parallel pick-and-place of large arrays of III-V semiconductors bring new heterogeneous integration capabilities for silicon photonics Valencia, Spain, and Research Triangle Park, North Carolina (May 11, 2022) – UPVfab, the microfabrication facility at the Universitat Politècnica de València, has acquired a Micro Transfer Printing (MTP) system supplied by X...

Live from SEMICON West Hybrid 2021 – It’s the 3D InCites Podcast!

Dec 16, 2021

I can’t tell you how much fun I had last week at SEMICON West! My favorite part has always been the conversations I have with industry colleagues on the show floor. Up until now, however, those conversations were distilled down and summarized in a blog post. But now, with our...

SEMICON Taiwan 2020 Takes the Hybrid Road

Sep 17, 2020

It is my pleasure to inform you that SEMICON Taiwan Hybrid will open next week from Sep. 23 (Wed.) – 25 (Fri), which will be the first SEMICON that offers both in-show and virtual experiences at the same time. Even though we cannot meet in person this time due to...

SUSS MicroTec: A 3D Approach

Dec 12, 2012

Leti Develops C2W Direct Metallic Bonding Technology for Customized 300mm Device Bonder

Feb 22, 2011

CEA-Leti has announced a multi-partner project to demonstrate high-alignment-accuracy (<1µm) chip-to-wafer structures made by direct metallic bonding. Such structures are required for high-performance 3D integrated circuits and could enable a wide range of applications in microelectronics as well as in optoelectronics or MEMS. Leti has acquired a customized 300mm FC300...

A Visit to SUSS MicroTec

Jul 08, 2009

It’s been a few years since I toured the US headquarters of SUSS MicroTec in Waterbury VT, so when general manager, Wilfried Bair invited me out to see their latest toolset developed...