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Kulicke & Soffa announced the introduction of its latest APTURA™ thermo-compression platform in addition to three new milestones relating to industry adoption of its chiplet-enabling thermo-compression technology. Recently, several of Kulicke & Soffa’s leading thermo-compression offerings have been selected at multiple Assembly & Test customers. In support of the rapid needs...
ST. FLORIAN, Austria, August 30, 2022—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has expanded its collaboration with the Industrial Technology Research Institute (ITRI), one of the world’s leading applied technology research institutes based in...
As I listened to keynote speakers and panelists at the recent 2022 IMAPS Advanced SiP Conference talk about the commercialization of chiplet technologies, I felt a sense of déjà vu. The key takeaways of the talks and panel discussions sounded eerily familiar. And then it hit me: these were the...
Watching the Intel Accelerated event recently brings to mind one of my favorite movies of all time: Rocky. Let me share the fact that Sylvester Stallone (3 years older than I am) and I actually grew up in the same NYC neighborhood, Hell’s Kitchen (he later moved to Philly). At...
PROPHESEE Joins IRT Nanoelec 3D Integration Program Will Work with CEA-Leti, STMicroelectronics, Mentor, EVG, and SET to Develop New 3D Event-Based Vision System GRENOBLE, France – Oct. 14, 2019 – PROPHESEE, the inventor of the world’s most advanced neuromorphic vision systems, joins the IRT Nanoelec consortium to help broaden the...
Since it first appeared several years ago, IFTLE has been a big-time proponent of pre-applied non-conductive film (NCF) combined with thermal compression bonding (TCB) for fine-pitch bump interconnection. This technology is now being used in mass production for 3D memory die stacking DRAM (3DS DRAM) and high bandwidth memory (HBM)...
Now that we’ve determined that advanced wafer level packaging — including embedded technologies, fan-out wafer level packaging, and 3D packaging — add value to the devices in which they are implemented, the next step is understanding which option offers the best cost/performance ratio for specific product applications. One of the...
Dow Corning, supplier of advanced silicon technology and materials to the semiconductor industry, and SUSS MicroTec, supplier of semiconductor processing equipment announced a collaboration on a temporary bonding solution for 3D through-silicon via (TSV) semiconductor packaging. As part of this non-exclusive agreement, the companies are developing a material and equipment...
EVG's EZR® (Edge Zone Release) and EZD® (Edge Zone Debond) Modules Enable Flexible Choice of Adhesives ST. FLORIAN, Austria, October 26, 2011 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has launched a suite...
EVG560HBL Significantly Increases Throughput for Volume HB-LED Production
