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August has been a thrilling month for the semiconductor industry, marked by notable achievements from our community members. From innovative new technological advancements and workforce development initiatives, to exciting industry events and partnerships, here’s a little about what our members have achieved. Technology Innovation: Lam Research has introduced Lam Cryo™...
If you were one of the almost 2000 attendees at ECTC 2024, held May 28-31 2024, in Denver, Co, then you must be feeling very important right now; especially if you’re an advanced packaging engineer. Whether you’re improving energy efficiency, increasing yield, delivering innovative process control solutions, designing next-generation advanced...
TSMC takes 61% of global foundry market share Counterpoint has released its global foundry market share ranking for 4Q 2023, showing that TSMC has a 61% market share driven by strong demand from AI and the restocking of smartphones. TSMC 5nm capacity utilization was maxed out at 100%, reportedly due...
Agreement includes a license to Adeia’s Hybrid Bonding Portfolio SAN JOSE, Calif., March 28, 2023 — Adeia Inc. (Nasdaq: ADEA) (“Adeia” or the “Company”), the company whose patented innovations enhance billions of devices, today announced that Kioxia Corporation, a world leader in flash memory and solid-state drives, entered into a long-term...
Agreement includes a license to Adeia’s Hybrid Bonding Portfolio SAN JOSE, Calif., March 28, 2023 — Adeia Inc. (Nasdaq: ADEA) (“Adeia” or the “Company”), the company whose patented innovations enhance billions of devices, today announced that Western Digital (Nasdaq: WDC), a global leader in data storage solutions, entered into a long-term...
Finishing up our coverage of the 2021 IEEE 3DIC conference, we take a closer look at glass embedding, 3D stacked packaging for retinal prosthesis, and the chiplet design exchange. Georgia Tech – Glass Embedding Madhavan Swaminathan, who has replaced Rao Tummala as the Director of the GaTech Packaging Research Center...
One of the hottest trends in semiconductor manufacturing today is wafer-level packaging (WLP). According to Allied Market Research, the global WLP market size is expected to reach $7.8 billion by 2022, registering a compound annual growth rate (CAGR) of 21.5% from 2016 to 2022. Broadly defined, WLP encompasses different integration...
Finishing up our look at the 2021 IEEE ISSCC, Forum 5 was entitled Enabling New System Architectures with 2.5D, 3D, and Chiplets. This was another clear example of a here-to-fore front-end conference now focusing on advanced packaging technologies. The session description states “The end of scaling drives innovative 2.5D, 3D...
The semiconductor industry has entered a new era and the role of design including the package has become increasingly important. No longer can the industry count on monolithic integration to achieve the economic gains of the previous era. New packaging solutions are being adopted to achieve the economic advantages that...
SAN JOSE, CA (FEBRUARY 6, 2020) – Xperi Corporation (NASDAQ: XPER) (“Xperi”) today announced that it entered into a new patent and technology license agreement with SK hynix, one of the world’s largest semiconductor manufacturers. The agreement includes access to Xperi’s broad portfolio of semiconductor intellectual property (IP) and a...
