Matches for your search: "hybrid bonding "
It was cold, a bit overcast, and I was headed to a SEMICON show in December. Usually, this would mean SEMICON Japan, but this was SEMICON West Hybrid 2021 during the second week of December in San Francisco. SEMI made the decision with its members last February to have SEMICON...
Rolla, Missouri – January 27th, 2020 – Brewer Science, Inc., is proud to introduce our first permanent bonding material during the European 3D & Systems Summit. This new material is included within the Brewer Science product family of PermaSOL™ materials designed to address device- and wafer-level packaging requirements. The new...
Technical papers and interactive poster to highlight the breakthrough capabilities of EVG’s ComBond® high-vacuum bonding system and low-temp laser debonding solution for “More than Moore” applications EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that new...
Fan-out wafer-level packaging (FOWLP) is a cost-effective way to achieve high interconnect density and to manage larger I/O counts within an affordable package. It enables smaller footprints, higher interconnect density, better routing and thinner packages than current technologies. [1] A standard FOWLP wafer comprises known good die (KGD) and a...
In recent years, the technology of 3D integration has evolved into an economically interesting road. In particular, the technology is used to package the CMOS imagers you find in your smartphone, the high-bandwidth DRAM memory stacks used in high-end computing, as well as in advanced graphics cards. 3D integration allows...
SAN JOSE, CA (August 28) — Tessera Technologies, Inc. announced the acquisition of Ziptronix, Inc. for $39 million in cash. The acquisition expands on Tessera’s existing advanced packaging capabilities by adding a low-temperature wafer bonding technology platform that will accelerate delivery of 2.5D and 3D IC solutions to semiconductor industry...
A novel copper interconnection technology is being pioneered by Georgia Tech’s Packaging Research Center (GT-PRC) to achieve manufacturable solder-free assembly at low temperatures. By interfacing engineering and process design, the Cu interconnections are shown to meet both thermal cycling and ultra-high current-handling needs. This technology is now being applied to mobile...
The semiconductor industry’s march toward broader 3D IC integration marked an important milestone this week at the 2013 Electronic Components & Technology Conference (ECTC), with the report of an advanced new temporary bonding solution for 3D Through Silicon Via (TSV) semiconductor packaging. The breakthrough was unveiled during ECTC’s 3D Materials...
First-ever Integration of In-line Metrology with Temporary Bonding/Debonding Enables More Repeatable and Reliable Process, Improved Yields and Lower Cost of Production ST. FLORIAN, Austria, June 21, 2011 – EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it...
Device of the Year Amkor Technologies, Inc: SWIFT SWIFT: uniquely developed to deliver a high yielding, high-performance package with the thinnest profile in the industry. This package can deliver 2um line/space lithography with up to 4 layers of RDL and a very dense network of memory interface vias from bottom...
