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July is always an exciting month for the semiconductor industry thanks to SEMICON West. July Member News reflects the significant progress our members made in sustainability, industry expansion, technology innovation, workforce development, and more. Achievements include but are not limited to advancements in emissions reduction targets and new technologies enhancing...
Continuing our look at the IMAPS Onshoring conference with a look at U.S. OSAT activities. (We should note that while this conference was listed for US & Canadian Citizens only, we are showing materials that were explicitly listed as “Unclassified; approved for public release; distribution unlimited” only.) IBM Bromont Rox...
SEMICON Taiwan is arguably the most influential semiconductor event in Taiwan, reaching records high in terms of scale in its 27 years of history, attracting 700 exhibitors, using a total of 2,450 booths, and organizing more than 20 international forums. This year it will spotlight eight key industry themes: advanced...
IMAPS Device Packaging Conference 2022 takes place next week – March 8-10, here in our home state of Arizona, and we at 3D InCites are very excited! There are over 300 attendees registered and the show floor and hotel are sold out. It’s been two years since the event took...
3DIC Integration using 3D stacked technologies in its true definition has a long history.1 Richard P. Feynman expressed this vision in 1985: “Another direction of improvement of computing power is to make physical machines three-dimensional.”2 Successively, several research and development (R&D) initiatives started world-wide. In the late 1980s, in a...
Temporary wafer bonding is widely employed in semiconductor device fabrication and in semiconductor device packaging applications, particularly now that changes in the Z dimension are calling for thinner and thinner silicon devices, and thinner and thinner packaged devices. This means that wafers and singulated die must be supported through parts...
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the all-new BONDSCALE™ automated production fusion bonding system. BONDSCALE is designed to fulfill a wide range of fusion/molecular wafer bonding applications, including engineered substrate manufacturing and 3D integration approaches...
It used to be that people thought about metrology for front-end process control and inspection for advanced packaging. As wafer level packaging (WLP) and heterogeneous integration (HI) approaches became more advanced, metrology processes began creeping into back-end process control, where measurement becomes trickier and more diversified. As part of the...
Part 1 of my 3D ASIP blog covered the five keynotes presented at 3D ASIP 2017. Part 2 focuses on more than 20 informative presentations, where focused experts gave an in-depth view of new and/or improved technologies for 3DIC-related advanced packaging. Before we address these, allow me a one-sentence recap...
Tessera Technologies has been testing the 3D waters for several years, with the launch of its wholly owned subsidiary, Invensas, in 2011, which focused first on what they called “bridge technologies” that leverage existing packaging technologies to meet higher density requirements while waiting for full implementation of 3D ICs. In...
