Matches for your search: "hybrid bonding "
MILPITAS, Calif. – June 7, 2022 – Sustainability, smart technologies and workforce development will take center stage at SEMICON West 2022 Hybrid, July 12-14 at the Moscone Center in San Francisco, as more than 200 industry leaders, visionaries and technology experts convene to present insights into the latest trends, innovations and developments...
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. About 1,500 professionals from the global microelectronics packaging industry are set to gather next week...
Direct Bond Interconnect (DBI®) hybrid bonding portfolio licensed to Canon to enhance image sensors in its industry-leading products SAN JOSE, Calif.—November 18, 2020—Xperi Holding Corporation(NASDAQ: XPER) (“Xperi”) today announced Canon’s license of Invensas DBI hybrid bonding intellectual property (IP) portfolio to further enhance its image sensors. Hybrid bonding, a foundational...
Temporary wafer bonding processes were initially developed for enabling three-dimensional (3D) stacked integrated circuits (ICs). For example, dies can be stacked on top of each other using die-to-wafer stacking to create 3D IC stacks. Through-Si vias (TSVs) and microbumps are used to interconnect the finished dies. These techniques require the...
New HI Competence Center to help customers accelerate new product development fueled by heterogeneous integration and advanced packaging EV Group (EVG) today announced that it has established the Heterogeneous Integration Competence Center™, which is designed to assist customers in leveraging EVG’s process solutions and expertise to enable new and enhanced...
I’ve been following the DBI story for over a decade (well before Xperi became a sponsor of 3D InCites). I’ve watched it grow from its humble, start-up beginnings as a Ziptronix process to its current rock-star status at Xperi/Invensas, as THE current hybrid bonding technology process for image sensors globally....
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced new capabilities on the EVG ComBond® automated high-vacuum wafer bonding platform specifically designed to support high-volume manufacturing (HVM) of advanced MEMS devices. These capabilities include a new vacuum bond...
This year’s keynote talks at the 2016 IMAPS Device Packaging Conference (DPC 2016) provided some new insight into a number of interesting areas of importance to the advanced packaging community. I already addressed Bill Chen’s talk, which focused on system-in-package (SiP) and introduced a 3D Fan-out SiP approach. Here, I’ll...
Last year, I did an analysis that included the topic of wafer-to-wafer bonding. Specifically, it was a comparison of the three variations available when stacking wafers and/or die—wafer-to-wafer (W2W), die-to-wafer (D2W), and die-to-die (D2D). The goal of that project was to build cost models for W2W and D2W (with the...
Emerging “More than Moore” and photonic applications benefit tremendously from the close integration of compound semiconductor materials. Recently, many of the improvements in device performance achieved within the semiconductor industry are a result of innovation and material research rather than traditional downscaling of design features. One of the major new...
