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Achieve higher integration density with collective die-to-wafer bonding Advanced packaging is currently facing a critical challenge to increase manufacturing efficiency without sacrificing device performance. Vertical integration techniques, such as multi-tier die stacking and hybrid bonding, enable increased integration density, therefore improving yield of high-quality devices. However, these highly precise processes...
Presentations to highlight breakthrough capabilities of EVG’s maskless lithography, hybrid bonding and IR laser release solutions for heterogeneous integration; EVG sees continued strong growth in region EV Group (EVG) today announced that it will highlight key advances in 3D integration process solutions, including hybrid and fusion wafer bonding, infrared (IR)...
In response to the rising costs of advanced nodes and the slowdown of Moore’s Law, major vendors – AMD, Intel, Apple, and Samsung – are making the shift towards chiplet-based systems using 3D technologies, which create novel system partitioning through modular and scalable architectures. These solutions optimize bandwidth with respect...
What an energizing week I had at IMAPS DPC 2023! I’ve said it before, but it’s worth saying again, the IMAPS Device Packaging Conference (IMAPS DPC) is one of my favorite annual events, and this year’s edition did not disappoint. There was a record turnout, great keynote talks, panel discussions,...
Let’s continue our look at the key presentations at IMAPS DPC 2022 from ASE, Amkor, Yole Développement and Adeia. ASE Lihong Cao discussed ASE’s “Enhanced Fanout Embedded Bridge Packaging Technology for Chiplet Integration” The packaging industry is looking for alternatives to silicon through silicon via (TSV) technologies. Embedded SI die...
IMAPS DPC 2022 This year’s IMAPS Device Packaging Conference (DPC) was live once again, though most of the live attendees were from the US and far fewer were from Europe and Asia than usual. The unique aspect of this year’s meeting was certainly the Global Business Council session (GBC) which...
Major Foundry Investments in the US Samsung, Intel, and TSMC are all making large foundry investments in the US. First reported in May, Samsung Electronics is reportedly now close to finalizing the site selection for its new $17B foundry in the United States. The investment would create a second foundry,...
The 2020 3D InCites Awards program has been a bit of a nail biter for us all, as we waited for the judges’ votes to see how they aligned with the online votes. Remember: the online votes serve as one judge. So, it was possible to win the online vote...
SEMICON West, San Francisco, Calif., July 10, 2012 — EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that its GEMINI® Automated Wafer Bonding System has become the first product to pass a systematic, rigorous Equipment Maturity Assessment...
SUSS MicroTec,supplier of equipment and process solutions for the semiconductor and related markets, launched the XBC300 Gen2, a high volume manufacturing platform for advanced 3D processing. The new bonding equipment can be used for permanent wafer bonding, or debonding and cleaning of 200mm and 300mm wafers. It is designed for...
