Matches for your search: "fan-out wafer level packaging "
The 72nd IEEE Electronic Components and Technology Conference (ECTC) was held again in person from May 31st to June 3rd, 2022. The conference brought together more than 1,500 industry professionals, academics, and students from 23 countries after three virtual years. A Big Thank You to our ECTC family for this...
Nepes Laweh corporation announced the successful production of the world’s first 600mm x 600mm large Panel Level Packaging (PLP) using Deca’s M-Series™ fan-out technologies. Nepes Laweh had a grand opening of the Cheongan Campus PLP Line on December 7th with the presence of the Minister of Trade, Industry and Energy,...
One of the hottest trends in semiconductor manufacturing today is wafer-level packaging (WLP). According to Allied Market Research, the global WLP market size is expected to reach $7.8 billion by 2022, registering a compound annual growth rate (CAGR) of 21.5% from 2016 to 2022. Broadly defined, WLP encompasses different integration...
Veeco’s WaferStorm® Platform and AP300™ Lithography System Deliver Premier Process Performance, Platform Flexibility and Low Cost of Ownership PLAINVIEW, New York, — Veeco Instruments Inc. (Nasdaq: VECO) announced today that Unisem Advanced Technologies Sdn Bhd (UAT) has purchased Veeco’s WaferStorm® single wafer solvent wet process tool and its AP300™ lithography...
The recipient of the 2019 3D InCites Award for Process of the Year was Belgian research institute, imec, for its two-step wafer-level transfer mold process for 3D die-to-wafer assembly. The individual who nominated them for the award didn’t provide any more detail than that. But luckily at ECTC 2019, when...
With heterogeneous integration, 3D, and advanced wafer-level packaging technologies officially declared the rising stars of the semiconductor industry, materials, process and equipment suppliers have pulled out their shiniest bells and whistles. Here’s a sampling of news and products that were on display at IWLCP 2018, October 23-25, 2018 at the...
Semiconductor device fabrication and packaging is rife with acronyms, and by my estimate, the Top 3 trafficked by speakers at the recent IMAPS Device Packaging Conference were the acronyms FOWLP, FOPLP, and MEMS. That would be fan-out wafer level packaging, fan-out panel level packaging, and microelectromechanical systems, respectively. It wasn’t...
2016 will be remembered as the year fan-out wafer level packaging (FOWLP) went mainstream, thanks to TSMC’s strategic move in the advanced packaging arena and especially its integrated fan-out (InFO) win inside the iPhone 7. Already in high-volume manufacturing (HVM), FOWLP volumes significantly increased in magnitude. Will this strong momentum...
As the two-dimensional (2D) shrinking of planar circuits (on which Gordon Moore based his famous observation) has become more difficult and expensive, the semiconductor industry has had to find other ways to continue to put more computing power and speed into less volume. At the same time, consumers are demanding...
Did anyone miss the Sound of Music bit during the Oscars? Anyway, with the sounds of “The Hills are alive..” in my head, I drove off the next day down to the Hill Country in Austin to the invitation-only, On The Road to Fine Feature IC Package Substrates and Interposers...
