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Nordson Test & Inspection today announced its participation in SEMICON Taiwan, one of the most anticipated events in the semiconductor industry. The event will take place from September 4-6, 2024 at TaiNEX Hall 1 and 2, Taipei, Taiwan. In booth #L0516, the company will be showcasing its state-of-the-art inspection and...
EVG achieves its highest rankings ever with 5 Star ratings across all applicable award categories; continues winning streak with 21st consecutive year listed among “THE BEST” suppliers ST. FLORIAN, Austria, June 27, 2023—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and...
Hello, I am Mandy Perdok. I am 20 years old and live in Milsbeek in the Netherlands. My hobbies include playing Netball (Team Sport), training/coaching the Netball youth team, and traveling. As a third-year student majoring in Chemical Engineering at the Fontys Hogeschool Eindhoven of Applied Science, I am completing...
Partnership will leverage firms’ respective heterogeneous-integration proficiencies to focus on development and optimization of full process-integration schemes for diverse high-density pixel array applications Kalispell, Mont. – June 2, 2022 – ClassOne Technology, a leading global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, today announced it is...
Last week our awesome and hardworking R&D-team managed to demonstrate CNF-growth on a 200mm silicon wafer in the Chalmers MC2 150mm lab in Gothenburg. This great achievement opens up new methods for better and simpler prototype manufacturing for customers utilizing 200mm production processes.
It’s been two years since I last visited EV Group headquarters in Schärding, Austria, so I was glad to be able attend EVG Technology Day on February 17, 2016 at the Fremont Marriott, in Fremont CA. It was a good reminder of the company’s many and varied capabilities in processes targeting 3D...
SPTS Technologies has launched its low temperature plasma-enhanced chemical vapor deposition (PECVD) solution for via-reveal passivation in 3D-IC packaging applications. Already proven in 300mm volume production fabs, the Delta fxP® PECVD system deposits dielectric layers onto bonded substrates at wafer temperatures below 200°C, with throughputs up to twice that of...
SEMI announced today the formation of a Three-Dimensional Stacked Integrated Circuits (3DS-IC) Standards Committee. 3DS-ICs are composed of a stack of two-dimensional die, and are viewed as critical in helping the semiconductor industry keep pace with Moore’s Law. Current integration methods like wirebond and flip chip have been in production...
With a focus on providing cost-effective and reliable solutions to speed manufacturing readiness of 3D technology options, experts from SEMATECH’s 3D interconnect program based at the College of Nanoscale Science and Engineering’s (CNSE) Albany NanoTech Complex outlined new developments in wafer bonding, copper removal, and wafer thinning at the 2010...
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