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An AI package is like a puzzle made up of individual pieces of different sizes and shapes, each one essential to the final product. Together, these pieces are typically integrated into a 2.5D IC package designed to reduce footprint and maximize bandwidth. A graphic processing unit (GPU) and multiple 3D...
EVG achieves its highest rankings ever with 5 Star ratings across all applicable award categories; continues winning streak with 21st consecutive year listed among “THE BEST” suppliers ST. FLORIAN, Austria, June 27, 2023—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and...
ST. FLORIAN, Austria, November 7, 2022—EV Group (EVG), a leading provider of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has strengthened its portfolio of optical lithography solutions with the unveiling of the next-generation 200-mm version of its EVG®150 automated resist processing...
Melville, NY (July 1, 2021) – Micross Components (“Micross”), a leading provider of high-reliability microelectronic product and service solutions for aerospace, defense, space, medical and industrial applications, today announced the acquisition of Semi Dice, LLC (“Semi Dice”), a global provider of high-reliability die & wafer products and value-added services. The...
EVG achieves ranking among THE BEST Suppliers to Foundation Chip Makers for the first time in survey results; continues win streak with 18th consecutive year listed among “THE BEST” suppliers EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology, and semiconductor markets, today...
Who was Madeline on Halloween? Before we start more tech coverage of IMAPS 2018 with a look at polymer dielectric advancements, long time readers know that you are due a Halloween update on my granddaughters. This year I’m focusing on Madeline who will be eleven in February. Her Halloween disguise...
Structured light and time of flight (ToF) are the dominant types of 3D sensing used for augmented reality, motion detection, gesture control, automotive/industrial 3D mapping, and proximity applications. These 3D sensing technologies are now appearing in smartphones. Apple’s iPhone X and its Face ID technology was not the first smartphone...
Last week, September 13 to be exact, TSMC held its Open Innovation Forum (OIP 2017) Symposium at the Santa Clara Convention Center. Before getting into product and market details, allow me to share some of my general impression of this, as usual, very well-organized event. After several decades of experience...
When 3D integration has been discussed in the past, whether in terms of a true 3D IC stack or an interposer-based design, the cost of 3D ICs has not always been part of the discussion. In the past couple of years, as 3D ICs have moved closer to reality, more attention...
I don’t know why it still surprises me to read conflicting reports on the progress of 3D TSVs. But I think Ron Huemoeller, Amkor, finally hit on it in his closing remarks during today’s webcast, “TSV Packaging at the Tipping Point”, moderated by Pete Singer, Solid StateTechnology/Extension Media. Huemoeller’s presentation and...
