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The 56th International Symposium on Microelectronics (IMAPS 2023) will be held October 2-5, 2023, at the Town & Country Resort in San Diego, California. This jam-packed, annual conference brings together industry engineers, researchers and top experts involved in advanced packaging and microelectronics assembly. Given the strength of the program, many...
EVG achieves its highest rankings ever with 5 Star ratings across all applicable award categories; continues winning streak with 21st consecutive year listed among “THE BEST” suppliers ST. FLORIAN, Austria, June 27, 2023—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and...
Hello, I am Mandy Perdok. I am 20 years old and live in Milsbeek in the Netherlands. My hobbies include playing Netball (Team Sport), training/coaching the Netball youth team, and traveling. As a third-year student majoring in Chemical Engineering at the Fontys Hogeschool Eindhoven of Applied Science, I am completing...
While advanced IC packaging is a fast-growing market, comprehensive package verification still has a ways to go. Unique package connectivity issues, such as missing or misplaced interposer/package bumps/pads, pin naming and text labeling issues, and the like, require new and enhanced layout vs. schematic (LVS)-like verification techniques that can move...
It is often claimed that 3D chip stacks offer the potential to meet current and future requirements of digital circuits, such as for performance, functionality, and power consumption. Specifically, both design paradigms “More Moore” and “More than Moore” will benefit from 3D chip stacking (and new technologies and materials). 3D...
It’s been two years since I last visited EV Group headquarters in Schärding, Austria, so I was glad to be able attend EVG Technology Day on February 17, 2016 at the Fremont Marriott, in Fremont CA. It was a good reminder of the company’s many and varied capabilities in processes targeting 3D...
And what are we going to do about it in 2015…? A moment ago I finished reading my predictions for 2014. I wrote them on January 11, 2014, almost exactly one year ago. After convincing myself that I was roughly on target, I am going to stick my neck out again,...
I recently had one of those moments of clarity that comes from asking different people the same questions and fitting all the varied answers together like a puzzle to come up with the big picture. In this case, the questions had to do with the various approaches being developed to...
Applied Materials, Inc. today announced a breakthrough technology for reducing power consumption in semiconductor chips with its new Applied Producer® OnyxTM film treatment system. By optimizing the molecular structure of the low k films that insulate the miles of wiring, or interconnects, on each chip, the Producer Onyx system enables customers to continue...
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