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LITHOSCALE® incorporates EVG’s MLE™ (Maskless Exposure) technology to bring the benefits of digital lithography to a wide range of applications and markets EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the LITHOSCALE® maskless exposure system – the...
EV Group (EVG) today unveiled its maskless exposure technology (MLE™), a revolutionary next-generation lithography technology developed to address future back-end lithography needs for advanced packaging, MEMS, biomedical and high-density printed circuit board (PCB) applications. The world’s first highly scalable maskless lithography technology for high-volume manufacturing (HVM), MLE combines high-resolution patterning...
Attending ECTC 2019 this year was like a trip through a time machine. From my post at the 3DInCites booth, I talked to people I’ve known for decades and others I was meeting for the first time. By visiting booths and listening to presentations, I gained insight into how the...
Once considered to be one of the simpler tasks in semiconductor device manufacturing, IC package design has become more complicated as it becomes more critical to the performance of the end-devices. Market drivers are more varied than ever. Time-to-market is more critical than ever. And advanced packaging options are more numerous...
The remaining two days of SEMI’s ISS 2018 dawned foggy and damp, making it a heck of a lot easier to head to the ballroom for a day and half full of inspiring talks versus ditching it all to answer the call of the pounding surf (I grew up on...
The 54th Design Automation Conference (DAC 54) at the Austin Convention Center was very different, compared to the last several years’ events. Walking the exhibition floor, listening to keynotes, SKY talks and CEO interviews I got the following key impressions: While still representing a big part of the audience, the...
In June 2014, SPTS co-produced a webinar with Ron Huemoeller of Amkor, titled “2.5D and 3D Packaging at the Tipping Point.” We forecasted that significant product announcements would be made over the next 18 months and we were right; sk Hynix, Samsung and Micron all announced readiness for their 3D stacked memory...
That Jan Vardaman, she’s so clever! I just finished reading her column on ECTC 2013 in Printed Circuit Design and Fab, and thought her quippy, Las Vegas-y references in the opening paragraph were right on the money. Vardaman’s take on ECTC was similar to my own, discussed here in my...
Day Two of the European 3D TSV Summit dawned bright and clear, with such a spectacular view of the nearby French Alps that it took real commitment to stay indoors and focus on the task at hand. But I have to admit that for the most part, it was worth...
Submit your nomination to recognize excellence in heterogeneous integration. Nominations are open to all who would like to recognize a technology, individual, or company that has made a significant contribution to the advancement of the heterogeneous roadmap including 3D packaging, interposer integration, advanced fan-out wafer level packaging, MEMS and sensors,...
