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EV Group (EVG) today unveiled its maskless exposure technology (MLE™), a revolutionary next-generation lithography technology developed to address future back-end lithography needs for advanced packaging, MEMS, biomedical and high-density printed circuit board (PCB) applications. The world’s first highly scalable maskless lithography technology for high-volume manufacturing (HVM), MLE combines high-resolution patterning...
Attending ECTC 2019 this year was like a trip through a time machine. From my post at the 3DInCites booth, I talked to people I’ve known for decades and others I was meeting for the first time. By visiting booths and listening to presentations, I gained insight into how the...
Once considered to be one of the simpler tasks in semiconductor device manufacturing, IC package design has become more complicated as it becomes more critical to the performance of the end-devices. Market drivers are more varied than ever. Time-to-market is more critical than ever. And advanced packaging options are more numerous...
The remaining two days of SEMI’s ISS 2018 dawned foggy and damp, making it a heck of a lot easier to head to the ballroom for a day and half full of inspiring talks versus ditching it all to answer the call of the pounding surf (I grew up on...
For several years now, Herb Reiter, eda2asic, and John Ferguson, Mentor Graphics, have been evangelizing about the necessity of assembly design kits (ADK), similar to the process design kits (PDKs) for chip designers, to help drive ecosystem capabilities for what is collectively now being called high density advanced packaging (HDAP),...
Grenoble, France – UnitySC, a wholly owned subsidiary of FOGALE Nanotech Group and a leader in inspection and metrology solutions for advanced semiconductor packaging, today announced the opening of its global headquarters in Grenoble, France, the heart of the French Silicon Valley. This location strategically positions the company in one of...
In less than two weeks, the 13th Annual Architectures for Semiconductor Integration and Packaging Conference (3D ASIP) kicks off at the Marriott San Francisco Airport, this year under the auspices of the International Microelectronics and Packaging Society (IMAPS). Long heralded as THE conference for 2.5D and 3D integration, the conference...
Day Two of the European 3D TSV Summit dawned bright and clear, with such a spectacular view of the nearby French Alps that it took real commitment to stay indoors and focus on the task at hand. But I have to admit that for the most part, it was worth...
Submit your nomination to recognize excellence in heterogeneous integration. Nominations are open to all who would like to recognize a technology, individual, or company that has made a significant contribution to the advancement of the heterogeneous roadmap including 3D packaging, interposer integration, advanced fan-out wafer level packaging, MEMS and sensors,...
NOMINATIONS HAVE BEEN EXTENDED TO WEDNESDAY, FEBRUARY 14, 2018. VOTING OPENS MONDAY, FEB 19, 2018. Submit your nomination to recognize excellence in heterogeneous integration. Nominations are open to all who would like to recognize a technology, individual, or company that has made a significant contribution to the advancement of the...
