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SAN JOSE, Calif.—July 10, 2024—Adeia Inc. (Nasdaq: ADEA), a leading research and development and intellectual property licensing company known for bringing innovations in the semiconductor and media technology sectors to market, was awarded Best Session Paper at the 2024 Electronic Components and Technology Conference (ECTC) held in Denver, Colorado on...
The 56th International Symposium on Microelectronics (IMAPS 2023) will be held October 2-5, 2023, at the Town & Country Resort in San Diego, California. This jam-packed, annual conference brings together industry engineers, researchers and top experts involved in advanced packaging and microelectronics assembly. Given the strength of the program, many...
Hello, I am Mandy Perdok. I am 20 years old and live in Milsbeek in the Netherlands. My hobbies include playing Netball (Team Sport), training/coaching the Netball youth team, and traveling. As a third-year student majoring in Chemical Engineering at the Fontys Hogeschool Eindhoven of Applied Science, I am completing...
Partnership will leverage firms’ respective heterogeneous-integration proficiencies to focus on development and optimization of full process-integration schemes for diverse high-density pixel array applications Kalispell, Mont. – June 2, 2022 – ClassOne Technology, a leading global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, today announced it is...
Last week our awesome and hardworking R&D-team managed to demonstrate CNF-growth on a 200mm silicon wafer in the Chalmers MC2 150mm lab in Gothenburg. This great achievement opens up new methods for better and simpler prototype manufacturing for customers utilizing 200mm production processes.
It is often claimed that 3D chip stacks offer the potential to meet current and future requirements of digital circuits, such as for performance, functionality, and power consumption. Specifically, both design paradigms “More Moore” and “More than Moore” will benefit from 3D chip stacking (and new technologies and materials). 3D...
It’s been two years since I last visited EV Group headquarters in Schärding, Austria, so I was glad to be able attend EVG Technology Day on February 17, 2016 at the Fremont Marriott, in Fremont CA. It was a good reminder of the company’s many and varied capabilities in processes targeting 3D...
I recently had one of those moments of clarity that comes from asking different people the same questions and fitting all the varied answers together like a puzzle to come up with the big picture. In this case, the questions had to do with the various approaches being developed to...
With a focus on providing cost-effective and reliable solutions to speed manufacturing readiness of 3D technology options, experts from SEMATECH’s 3D interconnect program based at the College of Nanoscale Science and Engineering’s (CNSE) Albany NanoTech Complex outlined new developments in wafer bonding, copper removal, and wafer thinning at the 2010...
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