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AIChE Conference

Brewer Science Presents Scalable, High-Purity Solutions for Semiconductor Manufacturing at AIChE

Oct 23, 2024

Achieving High-Volume, Zero-Defect Quality Polymer Purification Brewer Science, Inc., a high-volume manufacturer of ultrapure semiconductor materials, is presenting their latest innovation in polymer purification at the AIChE Conference from October 27th through 31st. Traditional Batch Polymer Precipitation Methods are Inefficient Balancing the industry’s needs to scale materials, while maintaining ultra...

IMAPS presentations

Indium Corporation Experts to Present Advanced Research at International Symposium on Microelectronics

Sep 20, 2024

Indium Corporation experts will lead three presentations and a poster presentation at the 57th International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS), from October 1-3, in Boston, Massachusetts. The first presentation, titled Novel Innovative Thermal Interface Materials for Bare Die Processors and Applications Methods,...

An Intel engineer holds a test glass core substrate panel at Intel's Assembly and Test Technology Development factories in Chandler, Arizona, in July 2023. Intel’s advanced packaging technologies come to life at the company's Assembly and Test Technology Development factories. (Credit: Intel Corporation)

IFTLE 602: Dr. Dev Palmer in at NAPMP; A New Player in Glass Core Substrates

Aug 21, 2024

Dr. Dev Palmer Takes over the Reins CHIPS NAPMP The Department of Commerce has announced that Dr. Dev Palmer has joined CHIPS for America’s Research and Development (R&D) Office as the director of the National Advanced Packaging Manufacturing Program (NAPMP). Dr. Palmer joins CHIPS for America from DARPA where he most recently...

Interconnectology 101: Before Switching to PVD, Consider Liquid Metal Ink

Jul 23, 2024

You may have heard of the company, Averatek. Founded in 2009 out of the Stanford Research Institute, it developed and licensed chemistries and advanced interconnect technologies for electronics. Although the company specialized in printed circuit boards (PCBs), Averatek’s new leadership saw an opportunity to apply its technology to advanced packaging....

Three Nordson Electronics Solutions machines

Nordson Electronics Solutions to Demonstrate Plasma Treatment and Automated Fluid Dispensing Systems for Electronics Manufacturing at SEMICON China 2024

Mar 06, 2024

Carlsbad, CA, USA – 5 March 2024 – Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, will demonstrate its latest  MARCH and ASYMTEK product divisions equipment for semiconductor manufacturing at SEMICON China 2024, booth 3645. Plasma removes impurities and activates surfaces to enhance flow and adhesion for...

Community Member Conversations from IMAPS 2023

Nov 02, 2023

At the 2023 IMAPS Symposium in October, I had some great community member conversations about some of the hot topics of the day. They shared their opinions on everything from the possibility of the U.S. onshoring advanced packaging technology in high volumes, to the impact of germanium and gallium restrictions...

Nordson Electronics Solutions to Demonstrate Popular Automated Fluid Dispensing Systems for Microelectronics Manufacturing at SEMICON China 2023

Jun 27, 2023

See equipment demonstrations for semiconductor packaging, and talk to Nordson experts in booth E4617 Carlsbad, CA, USA – 27 June 2023 – Nordson Electronics Solutions, a global leader in electronics manufacturing technologies, will demonstrate their latest solutions for semiconductor packaging and electronics manufacturing, with partner AMT at the SEMICON China...

Community Member Monthly Highlights — November

Dec 01, 2022

Onto Innovation announced the completion of a newly constructed cleanroom manufacturing area on site in Bloomington. Equipped with 20 new bays, the manufacturing floor will initially be used to build Onto’s edge and backside inspection modules, its probe card test and analysis systems, and its wafer handling modules. NHanced Semiconductors...

TechSearch International Examines High-Performance Package Options and Provides an Update on the Build-up Substrate Shortage

Aug 08, 2022

TechSearch International’s latest analysis describes high-performance package options with an update on TSMC’s new offerings, including the latest organics CoWoS® versions. New high-end product examples using fan-out on substrate are discussed. Features of the build-up substrates supporting redistribution layer (RDL) structures are provided. Applications for high-performance wafer-to-wafer hybrid bonding are...