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Three Nordson Electronics Solutions machines

Nordson Electronics Solutions to Demonstrate Plasma Treatment and Automated Fluid Dispensing Systems for Electronics Manufacturing at SEMICON China 2024

Mar 06, 2024

Carlsbad, CA, USA – 5 March 2024 – Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, will demonstrate its latest  MARCH and ASYMTEK product divisions equipment for semiconductor manufacturing at SEMICON China 2024, booth 3645. Plasma removes impurities and activates surfaces to enhance flow and adhesion for...

Community Member Conversations from IMAPS 2023

Nov 02, 2023

At the 2023 IMAPS Symposium in October, I had some great community member conversations about some of the hot topics of the day. They shared their opinions on everything from the possibility of the U.S. onshoring advanced packaging technology in high volumes, to the impact of germanium and gallium restrictions...

Nordson Electronics Solutions to Demonstrate Popular Automated Fluid Dispensing Systems for Microelectronics Manufacturing at SEMICON China 2023

Jun 27, 2023

See equipment demonstrations for semiconductor packaging, and talk to Nordson experts in booth E4617 Carlsbad, CA, USA – 27 June 2023 – Nordson Electronics Solutions, a global leader in electronics manufacturing technologies, will demonstrate their latest solutions for semiconductor packaging and electronics manufacturing, with partner AMT at the SEMICON China...

Community Member Monthly Highlights — November

Dec 01, 2022

Onto Innovation announced the completion of a newly constructed cleanroom manufacturing area on site in Bloomington. Equipped with 20 new bays, the manufacturing floor will initially be used to build Onto’s edge and backside inspection modules, its probe card test and analysis systems, and its wafer handling modules. NHanced Semiconductors...

TechSearch International Examines High-Performance Package Options and Provides an Update on the Build-up Substrate Shortage

Aug 08, 2022

TechSearch International’s latest analysis describes high-performance package options with an update on TSMC’s new offerings, including the latest organics CoWoS® versions. New high-end product examples using fan-out on substrate are discussed. Features of the build-up substrates supporting redistribution layer (RDL) structures are provided. Applications for high-performance wafer-to-wafer hybrid bonding are...

Heterogeneous Chiplet Design and Integration: A New Twist for SiP Design

Mar 01, 2022

A number of factors are converging and driving the chiplet design revolution. To start with the economic advantage of silicon scaling is slowing. The semiconductor industry is facing an inflection point as higher cost, lower yield, and reticle size limitations drive the need for viable alternatives to traditional monolithic solutions,...

What’s in the Apple Watch Series 6?

Jul 01, 2021

TechSearch International’s teardown of the Apple Watch Series 6 GPS+LTE examined 108 board-level packages plus another 17 packages inside modules and found 27% more wafer level packages (WLPs) than in the previous Series 5, including packages in the wireless charger. Apple used more multi-die modules in the new watch. X-ray...

Heterogeneous Chiplet Design and Integration

Jun 07, 2021

A number of factors are converging and driving the chiplet design revolution. To start with the economic advantage of silicon scaling is slowing. The semiconductor industry is facing an inflection point as higher cost, lower yield, and reticle size limitations drive the need for viable alternatives to traditional monolithic solutions,...