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Brewer Science Presents Scalable, High-Purity Solutions for Semiconductor Manufacturing at AIChE

Oct 23, 2024

Achieving High-Volume, Zero-Defect Quality Polymer Purification Brewer Science, Inc., a high-volume manufacturer of ultrapure semiconductor materials, is presenting their latest innovation in polymer purification at the AIChE Conference from October 27th through 31st. Traditional Batch Polymer Precipitation Methods are Inefficient Balancing the industry’s needs to scale materials, while maintaining ultra...

Indium Corporation Experts to Present Advanced Research at International Symposium on Microelectronics

Sep 20, 2024

Indium Corporation experts will lead three presentations and a poster presentation at the 57th International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS), from October 1-3, in Boston, Massachusetts. The first presentation, titled Novel Innovative Thermal Interface Materials for Bare Die Processors and Applications Methods,...

An Intel engineer holds a test glass core substrate panel at Intel's Assembly and Test Technology Development factories in Chandler, Arizona, in July 2023. Intel’s advanced packaging technologies come to life at the company's Assembly and Test Technology Development factories. (Credit: Intel Corporation)

IFTLE 602: Dr. Dev Palmer in at NAPMP; A New Player in Glass Core Substrates

Aug 21, 2024

Dr. Dev Palmer Takes over the Reins CHIPS NAPMP The Department of Commerce has announced that Dr. Dev Palmer has joined CHIPS for America’s Research and Development (R&D) Office as the director of the National Advanced Packaging Manufacturing Program (NAPMP). Dr. Palmer joins CHIPS for America from DARPA where he most recently...

Interconnectology 101: Before Switching to PVD, Consider Liquid Metal Ink

Jul 23, 2024

You may have heard of the company, Averatek. Founded in 2009 out of the Stanford Research Institute, it developed and licensed chemistries and advanced interconnect technologies for electronics. Although the company specialized in printed circuit boards (PCBs), Averatek’s new leadership saw an opportunity to apply its technology to advanced packaging....

Three Nordson Electronics Solutions machines

Nordson Electronics Solutions to Demonstrate Plasma Treatment and Automated Fluid Dispensing Systems for Electronics Manufacturing at SEMICON China 2024

Mar 06, 2024

Carlsbad, CA, USA – 5 March 2024 – Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, will demonstrate its latest MARCH and ASYMTEK product divisions equipment for semiconductor manufacturing at SEMICON China 2024, booth 3645. Plasma removes impurities and activates surfaces to enhance flow and adhesion for...

Community Member Conversations from IMAPS 2023

Nov 02, 2023

At the 2023 IMAPS Symposium in October, I had some great community member conversations about some of the hot topics of the day. They shared their opinions on everything from the possibility of the U.S. onshoring advanced packaging technology in high volumes, to the impact of germanium and gallium restrictions...

Executive Viewpoint: Update on Cleans

Aug 20, 2015

Last time I checked in with Kim Pollard, Technology Manager, Dynaloy, was a few years ago, when we talked about the importance of cleans for 3D ICs. Dynaloy, a subsidiary of Eastman Chemical Company, develops and creates chemistries specifically for the removal of photoresist, etch residues and other polymers. At...

3D ASIP 2013: Coming Down The Home Stretch to 3D IC Commercialization

Dec 16, 2013

For years, we’ve been talking about the performance and power benefits of 2.5D and 3D ICs. We’ve also been talking about the remaining challenges, and have steadily ticked off the technology-related ones. The “elephant-in-the-room” has been, and continues to be cost. But based on the messages of some key industry...

3D Super Chips, 2.5D Technology Advancements, and 3D through the EDA Lens

May 20, 2013

TSMC calls them 3D Super Chips. The rest of the industry calls it 3D heterogeneous integration. Whatever way you slice it, either 2.5D or 3D IC, it requires TSV technology for its method of interconnect. Here are a few recent items about the latest progress in the march to commercialization...

Progress is Progress in the Medical Device World

Sep 27, 2010

This was my second year attending the Medical Electronics Symposium, and I’m not sure what I was expecting, but when it came to technology advancements themselves, I noticed that not much exciting has happened since last year. Or maybe I’ve just been spoiled. Not every year can be about earth-shattering...