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Nordson Electronics Solutions to Demonstrate Popular Automated Fluid Dispensing Systems for Microelectronics Manufacturing at SEMICON China 2023

Jun 27, 2023

See equipment demonstrations for semiconductor packaging, and talk to Nordson experts in booth E4617 Carlsbad, CA, USA – 27 June 2023 – Nordson Electronics Solutions, a global leader in electronics manufacturing technologies, will demonstrate their latest solutions for semiconductor packaging and electronics manufacturing, with partner AMT at the SEMICON China...

Community Member Monthly Highlights — November

Dec 01, 2022

Onto Innovation announced the completion of a newly constructed cleanroom manufacturing area on site in Bloomington. Equipped with 20 new bays, the manufacturing floor will initially be used to build Onto’s edge and backside inspection modules, its probe card test and analysis systems, and its wafer handling modules. NHanced Semiconductors...

TechSearch International Examines High-Performance Package Options and Provides an Update on the Build-up Substrate Shortage

Aug 08, 2022

TechSearch International’s latest analysis describes high-performance package options with an update on TSMC’s new offerings, including the latest organics CoWoS® versions. New high-end product examples using fan-out on substrate are discussed. Features of the build-up substrates supporting redistribution layer (RDL) structures are provided. Applications for high-performance wafer-to-wafer hybrid bonding are...

Heterogeneous Chiplet Design and Integration: A New Twist for SiP Design

Mar 01, 2022

A number of factors are converging and driving the chiplet design revolution. To start with the economic advantage of silicon scaling is slowing. The semiconductor industry is facing an inflection point as higher cost, lower yield, and reticle size limitations drive the need for viable alternatives to traditional monolithic solutions,...

Heterogeneous Chiplet Design and Integration

Jun 07, 2021

A number of factors are converging and driving the chiplet design revolution. To start with the economic advantage of silicon scaling is slowing. The semiconductor industry is facing an inflection point as higher cost, lower yield, and reticle size limitations drive the need for viable alternatives to traditional monolithic solutions,...

Deca Collaborates with ASE and Siemens to Launch APDK™ Design Methodology

Mar 18, 2021

TEMPE, Arizona – March 18, 2021 – Deca, an industry-leading pure-play technology provider for advanced semiconductor packaging, announced the introduction of its new APDK™ (Adaptive Patterning® Design Kit) methodology. The solution is the result of Deca’s collaboration with Advanced Semiconductor Engineering, Inc. (ASE) and Siemens Digital Industries Software. Deca’s tight...

YES Adds Deca’s Rapid Cure Technology to its Product Line

Jan 27, 2021

Unique UV plus direct thermal exposure process brings throughput & performance advantages FREMONT, Calif. – Jan 25, 2021 YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and AR/VR applications, today announced that it has signed an agreement to license Deca Technologies’...

The Softer Side of the IMAPS Symposium

Oct 21, 2020

Because IMAPS is a society, there is a strong community aspect to its events. It was good to see that captured at this year’s symposium. I really enjoyed attending the live versions of the Society Awards presentation and the Diversity and Inclusion Roundtable. I also popped into the Student-Industry Roundtable...