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ERS electronic, the industry leader in the market of thermal management solutions for semiconductor manufacturing, reveals the details of its third-generation flagship thermal debond machine, ADM330. The machine was introduced to the market in 2007 as the first-of-its-kind. Since then, it has become an industry-favourite and can be found on...
A number of factors are converging and driving the chiplet design revolution. To start with the economic advantage of silicon scaling is slowing. The semiconductor industry is facing an inflection point as higher cost, lower yield, and reticle size limitations drive the need for viable alternatives to traditional monolithic solutions,...
TechSearch International’s teardown of the Apple Watch Series 6 GPS+LTE examined 108 board-level packages plus another 17 packages inside modules and found 27% more wafer level packages (WLPs) than in the previous Series 5, including packages in the wireless charger. Apple used more multi-die modules in the new watch. X-ray...
A number of factors are converging and driving the chiplet design revolution. To start with the economic advantage of silicon scaling is slowing. The semiconductor industry is facing an inflection point as higher cost, lower yield, and reticle size limitations drive the need for viable alternatives to traditional monolithic solutions,...
TEMPE, Arizona – March 18, 2021 – Deca, an industry-leading pure-play technology provider for advanced semiconductor packaging, announced the introduction of its new APDK™ (Adaptive Patterning® Design Kit) methodology. The solution is the result of Deca’s collaboration with Advanced Semiconductor Engineering, Inc. (ASE) and Siemens Digital Industries Software. Deca’s tight...
Unique UV plus direct thermal exposure process brings throughput & performance advantages FREMONT, Calif. – Jan 25, 2021 YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and AR/VR applications, today announced that it has signed an agreement to license Deca Technologies’...
Because IMAPS is a society, there is a strong community aspect to its events. It was good to see that captured at this year’s symposium. I really enjoyed attending the live versions of the Society Awards presentation and the Diversity and Inclusion Roundtable. I also popped into the Student-Industry Roundtable...
The fan-out wafer level package (FO-WLP) market is projected to grow 15.5% in units from 2020 to 2024. Growth is driven by use in mobile devices such as smartphones and smartwatches, automotive radar, and increasing adoption in high-performance computing. Wafer shipments are driven by adoption in AI accelerators, GPU/CPU, and...
Before we start this week’s blog, let me take the opportunity to wish all IFTLE readers a Merry Christmas and Happy New Year. As has been traditional for the past decade-plus, I include a 2019 photo of the granddaughters Hannah and Madeline, who, as you can see, continue to grow...
I’m a huge baseball fan. And while my favorite team, the Arizona Diamondbacks didn’t even make it into the playoffs, it doesn’t mean I’m not glued to my MLB app to keep track of the World Series. I LOVE IT! ALL OF IT! The plays, the jockeying for position, the...
