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Three Nordson Electronics Solutions machines

Nordson Electronics Solutions to Demonstrate Plasma Treatment and Automated Fluid Dispensing Systems for Electronics Manufacturing at SEMICON China 2024

Mar 06, 2024

Carlsbad, CA, USA – 5 March 2024 – Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, will demonstrate its latest  MARCH and ASYMTEK product divisions equipment for semiconductor manufacturing at SEMICON China 2024, booth 3645. Plasma removes impurities and activates surfaces to enhance flow and adhesion for...

Nordson Electronics Solutions to Demonstrate Popular Automated Fluid Dispensing Systems for Microelectronics Manufacturing at SEMICON China 2023

Jun 27, 2023

See equipment demonstrations for semiconductor packaging, and talk to Nordson experts in booth E4617 Carlsbad, CA, USA – 27 June 2023 – Nordson Electronics Solutions, a global leader in electronics manufacturing technologies, will demonstrate their latest solutions for semiconductor packaging and electronics manufacturing, with partner AMT at the SEMICON China...

Community Member Monthly Highlights — November

Dec 01, 2022

Onto Innovation announced the completion of a newly constructed cleanroom manufacturing area on site in Bloomington. Equipped with 20 new bays, the manufacturing floor will initially be used to build Onto’s edge and backside inspection modules, its probe card test and analysis systems, and its wafer handling modules. NHanced Semiconductors...

TechSearch International Examines High-Performance Package Options and Provides an Update on the Build-up Substrate Shortage

Aug 08, 2022

TechSearch International’s latest analysis describes high-performance package options with an update on TSMC’s new offerings, including the latest organics CoWoS® versions. New high-end product examples using fan-out on substrate are discussed. Features of the build-up substrates supporting redistribution layer (RDL) structures are provided. Applications for high-performance wafer-to-wafer hybrid bonding are...

Heterogeneous Chiplet Design and Integration: A New Twist for SiP Design

Mar 01, 2022

A number of factors are converging and driving the chiplet design revolution. To start with the economic advantage of silicon scaling is slowing. The semiconductor industry is facing an inflection point as higher cost, lower yield, and reticle size limitations drive the need for viable alternatives to traditional monolithic solutions,...

Heterogeneous Chiplet Design and Integration

Jun 07, 2021

A number of factors are converging and driving the chiplet design revolution. To start with the economic advantage of silicon scaling is slowing. The semiconductor industry is facing an inflection point as higher cost, lower yield, and reticle size limitations drive the need for viable alternatives to traditional monolithic solutions,...

Deca Collaborates with ASE and Siemens to Launch APDK™ Design Methodology

Mar 18, 2021

TEMPE, Arizona – March 18, 2021 – Deca, an industry-leading pure-play technology provider for advanced semiconductor packaging, announced the introduction of its new APDK™ (Adaptive Patterning® Design Kit) methodology. The solution is the result of Deca’s collaboration with Advanced Semiconductor Engineering, Inc. (ASE) and Siemens Digital Industries Software. Deca’s tight...

2.5D Interposer wafer - TSMC

3D Super Chips, 2.5D Technology Advancements, and 3D through the EDA Lens

May 20, 2013

TSMC calls them 3D Super Chips. The rest of the industry calls it 3D heterogeneous integration. Whatever way you slice it, either 2.5D or 3D IC, it requires TSV technology for its method of interconnect. Here are a few recent items about the latest progress in the march to commercialization...

Progress is Progress in the Medical Device World

Sep 27, 2010

This was my second year attending the Medical Electronics Symposium, and I’m not sure what I was expecting, but when it came to technology advancements themselves, I noticed that not much exciting has happened since last year. Or maybe I’ve just been spoiled.  Not every year can be about earth-shattering...