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EV Group Brings Revolutionary Layer Transfer Technology to High-volume Manufacturing with EVG®850 NanoCleave™ System

Dec 07, 2023

Infrared laser cleave technology enables ultra-thin-layer transfer from silicon substrates with nanometer precision, revolutionizing 3D integration for advanced packaging and transistor scaling FLORIAN, Austria, December 7, 2023—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG®850 NanoCleave™...

Emerald Rapids

IFTLE 560: Emerald Rapids – Is Intel Backing off on Chiplets?

Jun 27, 2023

A recent report by Semi Analysis (SA) notes that Intel has backed off on the use of chiplets in its 5th Generation Xeon Scalable Processor Emerald Rapids (EMR). SA reports that at a recent Intel webinar, VP Sandra Rivera revealed that EMR, Intel’s 5th Generation Xeon Scalable Processor, had backtracked...

2018 Industry Outlook: It’s Time to Get Serious about 5G

Feb 01, 2018

While the entire semiconductor industry is buzzing about explosive and sustained growth well into the 2020s driven by smart everything (homes, cities, industry), automotive electronics, artificial intelligence and more, what’s truly exciting is how we are going to support the connectivity of all those applications. 5G is where it all...

Meet Us at ECTC 2017 in Walt Disney World

May 02, 2017

As each year passes, advanced packaging technologies offer more versatile solutions for cost-effective low-end applications, while 3D integration advancements continue to improve the performance of leading-edge products. This will be reflected at the 67th Annual Electronic Components and Technology Conference (ECTC), which takes place May 30, June 2, 2017, at...

The Edge of 3D: 3D SoC VLSI and Si Photonics

Feb 08, 2017

Last week, I posted an executive summary of this year’s European 3D Summit, touching on the highlights and general takeaways based on the closing remarks I delivered at this year’s well-attended event, which took place January 23-25, 2017 at Minatec Campus in Grenoble. In this post, we’ll take a deeper...

ASMC 2016, the Return of MEPTEC Luncheons, and Your May Calendar

May 06, 2016

The Saratoga Springs, NY, horse racing season starts in late July, following a racing tradition that dates to the 1860s. That’s a pretty long run indeed, and it’s one of the things, along with the healing spring waters, successful Revolutionary War battle history, and “summering” by well-to-do Boston and New...

Amkor: SLIM

Jun 22, 2015

Amkor’s SLIM (siliconless integrated module) is a dies-last package technology providing the thinnest possible form factor with the highest level of integration by use of back-end-of-line technology combined with assembly-based fan-out architectures.  It has optimal registration, 3D access to top and bottom side of package and the finest line RDL capability...

What 3D Means in eWLB

Nov 14, 2012

Last week (November 6) STATS ChipPAC issued a press release announcing that its advanced eWLB provides a platform for 2.5D and 3D technologies.  In search of further information about this, I found a feature article recently published in Solid State Technology that explained how eWLB can be leveraged for 2.5D and...

Filled vs. conformal vias: the consensus

Oct 06, 2009

Dr. Zhang, I think we have reached a verdict.

Bob Patti wrote in to confirm Anonymous Caller’s statement regarding polymer-filled, copper-lined TSVs, and also provided some additional data to support his comments. I’ve taken the liberty of paraphrasing his comments here:

With the caveat that he...