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Latest Generation Front-end Cleaning Tool Reduces Chemical Use by 75% ACM Research, Inc., a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging applications, today announced a major performance breakthrough for its flagship Ultra C Tahoe Cleaning tool. The resulting enhancements are designed to meet demanding technical...
Continuing our coverage of ECTC 2021, let’s take a look at the session on Heterogeneous Integration (HI) using 2.XD/3D packaging, chaired by Subash Shinde of Notre Dame and John Knickerbocker of IBM. IBM Introduces Direct Bonded HI Si Bridge Technology Though they are not manufacturing chips or packages anymore, IBM...
Minneapolis, Minnesota— November 18th, 2020 — CyberOptics® Corporation a leading global developer and manufacturer of high-precision 3D sensing technology solutions, will present at the Virtual IEEE International Conference on Physical Assurance and Inspection of Electronics (PAINE) on December 16th at 8:00amCT. Tim Skunes, VP of R&D at CyberOptics, will share the technical presentation...
Nimes, France, April 15, 2016 – FOGALE Nanotech today announced that it has acquired Altatech, a specialized technology leader in the development of wafer inspection and material deposition tools for semiconductor manufacturing. Altatech SAS has headquarters in Grenoble, France, located in the center of the French Silicon Valley with a...
Through silicon via (TSV) technology is a key design element being incorporated into more and more advanced packaging designs today. TSVs offer distinct benefits in form factor and improved performance and can enable new, innovative designs not previously possible. To scale this valuable technology and spark industry adoption, there is...
Now that the “technology bricks” for building 2.5D devices and 3D ICs have been essentially qualified, the focus has turned to optimizing them for improved cost of ownership (CoO). At last week’s European 3D TSV Summit, in Grenoble, France, many of the supplier presentations demonstrated how their companies have been...
For me, the most exciting news so far at this year’s 3D ASIP conference has been the announcement that Tezzaron Semiconductor is licensing both Ziptronix’s Zibond and DBI technologies . Really, I did backflips when I read the press release, because I have a soft spot for technology innovators and...
To enable high-volume production readiness of 3D-based products, SEMATECH’s 3D Interconnect and Manufacturability programs will be conducting Equipment Maturity Assessments (EMAs) of several critical 3D tools during 2012 to establish functional equipment capabilities and address high volume manufacturing maturity issues. The assessment is a cooperative effort among experts from SEMATECH’s...
The official inauguration of STATS ChipPAC’s 300mm eWLB facility was held September 15, at the company's Yishun facility in Singapore with more than 150 local dignitaries, customer representatives, business partners and management participating. In April of 2010, STATS ChipPAC established itself as the first in the world to implement 300mm...
At MIT Lincoln Labs (MITLL), R&D processes developing 3D chips using silicon-on-insulator (SOI) wafers is the sole focus. As Phil Garrou, Ph.D.
