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Ultra C Tahoe

ACM Research Announces Major Performance Breakthrough for Ultra C Tahoe Cleaning Tool

Latest Generation Front-end Cleaning Tool Reduces Chemical Use by 75% ACM Research, Inc., a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging applications, today announced a major performance breakthrough for its flagship Ultra C Tahoe Cleaning tool. The resulting enhancements are designed to meet demanding technical...

IFTLE 491: IBM Simplifies Si Bridge Technology              

Continuing our coverage of ECTC 2021, let’s take a look at the session on Heterogeneous Integration (HI) using 2.XD/3D packaging, chaired by Subash Shinde of Notre Dame and John Knickerbocker of IBM. IBM Introduces Direct Bonded HI Si Bridge Technology Though they are not manufacturing chips or packages anymore, IBM...

Catching up with imec’s Eric Beyne

Eric Beyne (imec) and I go way back. He’s the Scientific Director of Advanced Packaging Technologies at imec, and ever since my Advanced Packaging days, he’s been a valuable resource whenever I have technology questions about any part of the spectrum of 3D integration technologies. Basically, I can count on...

SEMATECH to conduct rigorous manufacturability assessments to enable high volume manufacturing readiness of 3D technology

To enable high-volume production readiness of 3D-based products, SEMATECH’s 3D Interconnect and Manufacturability programs will be conducting Equipment Maturity Assessments (EMAs) of several critical 3D tools during 2012 to establish functional equipment capabilities and address high volume manufacturing maturity issues. The assessment is a cooperative effort among experts from SEMATECH’s...

STATS ChipPAC Celebrates Grand Opening of 300mm eWLB Facility

The official inauguration of STATS ChipPAC’s 300mm eWLB facility was held September 15, at the company's Yishun facility in Singapore with more than 150 local dignitaries, customer representatives, business partners and management participating. In April of 2010, STATS ChipPAC established itself as the first in the world to implement 300mm...