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We presume all are excited about the upcoming SEMICON West show. I know we sure are! Be sure to stop by the 3D InCites booth #731 and say hi or if you are walking by the SEMI booth Francoise may be in action recording a Podcast, acting as the official...
Minneapolis, Minnesota— November 18th, 2020 — CyberOptics® Corporation a leading global developer and manufacturer of high-precision 3D sensing technology solutions, will present at the Virtual IEEE International Conference on Physical Assurance and Inspection of Electronics (PAINE) on December 16th at 8:00amCT. Tim Skunes, VP of R&D at CyberOptics, will share the technical presentation...
Equipment Communication Leadership in Wafer Fabrication For many years the semiconductor industry’s wafer fabrication facilities, where semiconductor devices are manufactured on [principally] silicon substrates, have universally embraced and mandated the GEM standard on nearly 100% of the production equipment. This includes the complete spectrum of front-end-of-line (FEOL – device formation)...
Nimes, France, April 15, 2016 – FOGALE Nanotech today announced that it has acquired Altatech, a specialized technology leader in the development of wafer inspection and material deposition tools for semiconductor manufacturing. Altatech SAS has headquarters in Grenoble, France, located in the center of the French Silicon Valley with a...
Through silicon via (TSV) technology is a key design element being incorporated into more and more advanced packaging designs today. TSVs offer distinct benefits in form factor and improved performance and can enable new, innovative designs not previously possible. To scale this valuable technology and spark industry adoption, there is...
What is today’s biggest threat to continued growth in the semiconductor industry? Subramani Kengeri, Vice President, Advanced Technology Architecture, GLOBALFOUNDRIES, opening the 24th annual SEMI Advanced Semiconductor Manufacturing Conference in Saratoga Springs, NY, asked just that question in his keynote address. (Asked it twice, actually; once at the beginning of...
Now that the “technology bricks” for building 2.5D devices and 3D ICs have been essentially qualified, the focus has turned to optimizing them for improved cost of ownership (CoO). At last week’s European 3D TSV Summit, in Grenoble, France, many of the supplier presentations demonstrated how their companies have been...
For me, the most exciting news so far at this year’s 3D ASIP conference has been the announcement that Tezzaron Semiconductor is licensing both Ziptronix’s Zibond and DBI technologies . Really, I did backflips when I read the press release, because I have a soft spot for technology innovators and...
To enable high-volume production readiness of 3D-based products, SEMATECH’s 3D Interconnect and Manufacturability programs will be conducting Equipment Maturity Assessments (EMAs) of several critical 3D tools during 2012 to establish functional equipment capabilities and address high volume manufacturing maturity issues. The assessment is a cooperative effort among experts from SEMATECH’s...
At MIT Lincoln Labs (MITLL), R&D processes developing 3D chips using silicon-on-insulator (SOI) wafers is the sole focus. As Phil Garrou, Ph.D.
