Matches for your search: "fan-out wafer level packaging "
Adoption of advanced packaging is accelerating as the benefit of the classic Moore’s Law transistor shrink diminishes on a monolithic die. Advanced packages enable the heterogenous integrations of multiple different die through high-density interconnects, for improved device performance and smaller footprint. Advanced packaging architectures like Intel’s Embedded Multi-Die Interconnect Bridge,...
Remember when device node scaling was the semiconductor superstar, and advanced packaging was the back-up singer? At the 15th Annual IMAPS Device Packaging Conference, held March 5-7, 2019, in Fountain Hills, AZ, it became clear how rapidly that hierarchy has shifted. From the keynotes to the panel discussion, to the...
One topic that has been under hot debate in the semiconductor advanced packaging sector for the past few years is fan-out panel-level packaging (FOPLP). In theory, the concept of taking fan-out from a 300-mm reconstituted wafer to a large panel format as a way to lower costs seems simple, and...
These days, the first thing that comes to mind when someone mentions fan-out (FO) technology is Apple’s A10 processor built on TSMCs integrated fan-out (InFO) technology. It’s the superstar application that put FO on the map and into high volume manufacturing. However, equally important to remember are the numerous low-density...
Long gone are the days of the “killer app” and the notion that a single device market like personal computers (PCs) or smartphones alone can make or break the semiconductor industry. In fact, while both those markets have softened, a multitude of emerging technologies including 5G, artificial intelligence (AI), internet...
In recent years, the technology of 3D integration has evolved into an economically interesting road. In particular, the technology is used to package the CMOS imagers you find in your smartphone, the high-bandwidth DRAM memory stacks used in high-end computing, as well as in advanced graphics cards. 3D integration allows...
FLORIAN, Austria, March 8, 2017—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled the IQ Aligner NT—its latest and most advanced automated mask alignment system for high-volume advanced packaging applications. Featuring high-intensity and high-uniformity exposure optics, new wafer...
For the fourth consecutive year, the Impress Lounge played host to the 3D InCites Awards Ceremony, during which individuals, companies, and products were recognized by their peers for excellence in 3D packaging technologies. This year, we mixed it up a bit, and rather than recognize the processes, materials, designs and...
SAN JOSE, Calif.,- Advanced Semiconductor Engineering, Inc. (TAIEX: 2311, NYSE: ASX and Deca Technologies, a subsidiary of Cypress Semiconductor Corp. (NASDAQ: CY), today announced the signing of an agreement whereby ASE will invest $60 million in Deca and will license Deca’s M-Series™ Fan-out Wafer-Level Packaging (FOWLP) technologies and processes. As...
Dr. Phil Garrou, Microelectronic Consultants of NC, USA Dr. Phil Garrou is a subject matter expert for DARPA and runs his consulting company Microelectronic Consultants of NC in the RTP NC area. He retired from Dow Chemical in 2004 as Global Director of Technology for their Advanced Electronic Materials business...
